Chemical content BC856AW-Q

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Type numberPackagePackage descriptionTotal product weight
BC856AW-QSOT323SC-705.52641 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9346648261351126030 s123520 s3Seremban, Malaysia; Suqian, China; Melaka, Malaysia; Dongguan, China; D-22529 HAMBURG, Germany 
9346648261151126030 s123520 s3Dongguan, China; Seremban, Malaysia; D-22529 HAMBURG, Germany; Melaka, Malaysia; Suqian, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.04000100.000000.72380
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.001660.090000.03013
Carbon (C)7440-44-00.000740.040000.01339
Chromium (Cr)7440-47-30.001660.090000.03013
Cobalt (Co)7440-48-40.007960.430000.14395
Iron (Fe)7439-89-60.8260244.6500014.94686
Manganese (Mn)7439-96-50.012760.690000.23098
Nickel (Ni)7440-02-00.6389934.5400011.56248
Phosphorus (P)7723-14-00.000370.020000.00670
Silicon (Si)7440-21-30.004810.260000.08704
Sulphur (S)7704-34-90.000370.020000.00670
Pure metal layerCopper (Cu)7440-50-80.3117216.850005.64064
Silver (Ag)7440-22-40.042922.320000.77663
Mould CompoundFillerSilica fused60676-86-02.5534075.1000046.20359
PigmentCarbon black1333-86-40.010200.300000.18457
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.5950017.5000010.76648
Phenol Formaldehyde resin (generic)9003-35-40.241407.100004.36812
Post-PlatingImpurityAntimony (Sb)7440-36-00.000010.003000.00012
Bismuth (Bi)7440-69-90.000000.001000.00004
Copper (Cu)7440-50-80.000000.001000.00004
Lead (Pb)7439-92-10.000010.005000.00021
Tin solderTin (Sn)7440-31-50.2299899.990004.16142
WirePure metalCopper (Cu)7440-50-80.00641100.000000.11593
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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