×

Chemical content BSS138BKS

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
BSS138BKSSOT363SC-885.46853 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934065728115512601235Dongguan, China; Kyoto, Japan; Seremban, Malaysia 
934065728125112601235Dongguan, China; Kyoto, Japan; Seremban, Malaysia 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieAluminium alloyAluminium (Al)7429-90-50.002542.540000.04645
Doped siliconSilicon (Si)7440-21-30.0910391.030001.66462
Gold alloyGold (Au)7440-57-50.006436.430000.11758
subTotal0.10000100.000001.82865
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.001860.090000.03407
Carbon (C)7440-44-00.000830.040000.01514
Chromium (Cr)7440-47-30.004350.210000.07949
Cobalt (Co)7440-48-40.008900.430000.16277
Iron (Fe)7439-89-60.9811847.4000017.94230
Manganese (Mn)7439-96-50.017600.850000.32175
Nickel (Ni)7440-02-00.7392035.7100013.51729
Phosphorus (P)7723-14-00.000410.020000.00757
Silicon (Si)7440-21-30.005380.260000.09842
Sulphur (S)7704-34-90.000410.020000.00757
Pure metal layerCopper (Cu)7440-50-80.2713813.110004.96252
Silver (Ag)7440-22-40.038501.860000.70406
subTotal2.07000100.0000037.85295
Mould CompoundAdditiveNon hazardousProprietary0.084682.900001.54850
Triphenylphosphine603-35-00.001460.050000.02670
FillerSilica -amorphous-7631-86-92.1024072.0000038.44543
PigmentCarbon black1333-86-40.001460.050000.02670
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.4380015.000008.00947
Phenol Formaldehyde resin (generic)9003-35-40.2920010.000005.33964
subTotal2.92000100.0000053.39644
Post-PlatingImpurityAntimony (Sb)7440-36-00.000010.003000.00020
Bismuth (Bi)7440-69-90.000000.001000.00007
Copper (Cu)7440-50-80.000000.001000.00007
Lead (Pb)7439-92-10.000020.005000.00034
Tin solderTin (Sn)7440-31-50.3699699.990006.76531
subTotal0.37000100.000006.76599
WirePure metalCopper (Cu)7440-50-80.00853100.000000.15599
subTotal0.00853100.000000.15599
total5.46853100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.