Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Chemical content BSS138BKS

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
BSS138BKSSOT363SC-885.468530 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934065728115512601235
934065728125112601235
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieAluminium alloyAluminium (Al)7429-90-50.0025402.5400000.046448
Doped siliconSilicon (Si)7440-21-30.09103091.0300001.664616
Gold alloyGold (Au)7440-57-50.0064306.4300000.117582
subTotal0.100000100.0000001.828645
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.0018630.0900000.034068
Carbon (C)7440-44-00.0008280.0400000.015141
Chromium (Cr)7440-47-30.0043470.2100000.079491
Cobalt (Co)7440-48-40.0089010.4300000.162768
Iron (Fe)7439-89-60.98118047.40000017.942299
Manganese (Mn)7439-96-50.0175950.8500000.321750
Nickel (Ni)7440-02-00.73919735.71000013.517289
Phosphorus (P)7723-14-00.0004140.0200000.007571
Silicon (Si)7440-21-30.0053820.2600000.098418
Sulphur (S)7704-34-90.0004140.0200000.007571
Pure metal layerCopper (Cu)7440-50-80.27137713.1100004.962522
Silver (Ag)7440-22-40.0385021.8600000.704065
subTotal2.070000100.00000037.852951
Mould CompoundAdditiveNon hazardousProprietary0.0846802.9000001.548497
Triphenylphosphine603-35-00.0014600.0500000.026698
FillerSilica -amorphous-7631-86-92.10240072.00000038.445432
PigmentCarbon black1333-86-40.0014600.0500000.026698
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.43800015.0000008.009465
Phenol Formaldehyde resin (generic)9003-35-40.29200010.0000005.339643
subTotal2.920000100.00000053.396434
Post-PlatingImpurityAntimony (Sb)7440-36-00.0000110.0030000.000203
Bismuth (Bi)7440-69-90.0000040.0010000.000068
Copper (Cu)7440-50-80.0000040.0010000.000068
Lead (Pb)7439-92-10.0000180.0050000.000338
Tin solderTin (Sn)7440-31-50.36996399.9900006.765310
subTotal0.370000100.0000006.765986
WirePure metalCopper (Cu)7440-50-80.008530100.0000000.155988
subTotal0.008530100.0000000.155988
total5.468530100.000000100.000000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.