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Chemical content BZT52-B5V1

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Type numberPackagePackage descriptionTotal product weight
BZT52-B5V1SOD123SOD212.06413 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934071152118212601235Seremban, Malaysia; Dongguan, China; D-22529 HAMBURG, Germany 
934071152115212601235Seremban, Malaysia; D-22529 HAMBURG, Germany; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.04000100.000000.33156
subTotal0.04000100.000000.33156
Lead FrameCopper alloyCopper (Cu)7440-50-83.5331894.4700029.28664
Iron (Fe)7439-89-60.077792.080000.64482
Phosphorus (P)7723-14-00.001500.040000.01240
Zinc (Zn)7440-66-60.004860.130000.04030
Pure metal layerCopper (Cu)7440-50-80.062461.670000.51772
Silver (Ag)7440-22-40.060211.610000.49912
subTotal3.74000100.0000031.00100
Mould CompoundAdditiveNon hazardousProprietary0.234032.900001.93988
Triphenylphosphine603-35-00.004040.050000.03345
FillerSilica -amorphous-7631-86-95.8104072.0000048.16261
PigmentCarbon black1333-86-40.004040.050000.03345
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-21.2105015.0000010.03388
Phenol Formaldehyde resin (generic)9003-35-40.8070010.000006.68925
subTotal8.07000100.0000066.89252
Post-PlatingImpurityLead (Pb)7439-92-10.000010.004500.00008
Non hazardousProprietary0.000120.055500.00097
Tin solderTin (Sn)7440-31-50.2098799.940001.73965
subTotal0.21000100.000001.74070
WirePure metalCopper (Cu)7440-50-80.00413100.000000.03427
subTotal0.00413100.000000.03427
total12.06413100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.