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    • Discover Nexperia’s extensive portfolio of essential semiconductors which enable the basic functionality of virtually every commercial electronic design in the world – from automotive and industrial to mobile and consumer applications.

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    Bipolar transistors
    • A wide range of bipolar transistors helps you easily fulfil your system requirements. That includes simple bipolar building blocks and a comprehensive range of space and cost saving resistor-equipped transistors right up to our Breakthrough In Small Signal series of low VCEsat devices.

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      • 3-terminal adjustable shunt regulators
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    • Our extensive diode portfolio offers the flexibility you need in today's market - whether it is a simple Zener, a highly efficient Schottky rectifier, a fast recovery or controlled avalanche switching diode.

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    • Covering ESD protection and TVS devices as well as common-mode choke and EMI filtering, Nexperia's protection technologies continue to evolve to offer the highest level of protection in the industry's smallest packages.

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      • 1200 V SiC MOSFETs
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    • For a variety of high-voltage (650 V) and low-voltage (40-150 V) applications Nexperia GaN FETs deliver the fastest transition / switching capability , best power efficiency and enhanced power density through reduced conduction and switching losses.

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      • 650 V cascode GaN FETs
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    • Addressing the growing demand for efficient, high-voltage power conversion and motor drives, Nexperia's IGBTs feature a robust and cost-effective carrier stored trench-gate (CSTBT) advanced field-stop (FS) construction.

      IGBTs
      • 650 / 1200 V discrete IGBTs
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    • Alongside a comprehensive portfolio of logic functions, analog switches and I²C interface portfolio, Nexperia delivers a grwoing range of power ICs that enable innovative solutions focused on reducing our customer’s BOM cost, improving system efficiency and robustness.

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      Automotive qualified products (AEC-Q100/Q101)
      • Automotive bipolar transistors
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    • With a commitment to innovation and sustainability, our components set benchmarks in efficiency, empowering our global customer base to develop energy-efficient and cutting-edge solutions for virtually every commercial electronic design in the world. 

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    • Today’s cars are undergoing the greatest transformation the industry has seen. Continued electrification is resulting in significant changes from the powertrain right through to the cloud with ever more electronic functionality being added to increase safety and comfort. 

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    • Our phones are firmly ensconced in our lives – indispensable tools for information, networking, entertainment and a whole range of services from banking to calorie counting. But they need components that occupy little board space, help extend battery life and support sophisticated functionality.

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    • When we think of computing and consumer applications we tend to envisage laptops and washing machines. However today's applciations offer a whole swathe of new and innovative products - from robot vacuum cleaners to self-charging remote controls.

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    Sub-systems: Power conversion topologies
    • Virtually every electronic device relies on some form of power conversion. Whether it is transforming AC grid power into a DC power rail, boosting a DC battery voltage or simply handling the increasingly diverse range of power rails in today’s electronic systems. 

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    Sub-systems: General
    • Any complex system can be broken down into a number of sub-systems, which can appear in a host of applications. From motor drives and power supplies to constant current sources for stable driving of LED strings, The only difference between these sub-systems are their specifications and overall efficiency.

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    Interactive application notes
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      • IAN50002 - LED side light SEPIC DC-to-DC converter
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      • IAN50004 - Using power MOSFETs in DC motor control applications
      • IAN50005 - Paralleling power MOSFETs in high power applications
      • IAN50006 - Power MOSFETs in linear mode
      • IAN50007 - Conducted battery line transients
      • IAN50009 - Power MOSFET applications in automotive BLDC and PMSM drives
      • IAN50012 - Nexperia Precision Electrothermal models for Power MOSFETs
      • IAN50016 - MOSFETs for airbag applications
      • Application notes
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      • IAN50019 - Thermal boundary condition study on MOSFET packages and PCB substrates
      • IAN50020 - MOSFETs in Power Switch applications
    Advanced Support Tools
    • Nexperia doesn’t just develop high-performance power products and innovative power technologies. We also create the most advanced tools to provide knowledge, learning, and support for design engineers.

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  • Chemical content BZX84-A2V7

    Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

    • Chemical Content
    • China RoHS
    • Soldering
    12NC OPN Type No. Package State MSL
    934023110215BZX84-A2V7,215BZX84-A2V7SOT23 (TO-236AB)RFS1
    REACHCompliant with Regulation 1907/2006/EC (REACH). Does not contain REACH SVHC substances exceeding 1000 ppm of the article.
    EU RoHSCompliant with Directive 2011/65/EU, amended by Directive 2015/863/EU, on the restriction of the use of certain hazardous substances in electrical and electronic equipment ('RoHS 2 amended') without exemptions.
    CN RoHSCompliant with Chinese ACPEIP (Administration on the Control of Pollution Caused by Electronic Information Products) (CN RoHS) without exemptions.
    ELVCompliant with Directive 2000/53/EC, amended by Directive 2023/533, on end of life vehicles (ELV) without exemptions.
    PFASDoes not contain any intentionally added per- and polyfluoroalkyl substances (PFAS).
    CA Proposition 65Contains California Proposition 65 substance(s) [at the article level]: substance 1333-86-4: 318 ppm; substance 7439-92-1: 1 ppm; substance 7440-02-0: 120328 ppm; substance 7440-48-4: 1431 ppm;
    IEC 62474Contains IEC 62474 substance(s) [at the article level]: substance 1333-86-4: 318 ppm; substance 7439-92-1: 1 ppm; substance 7440-02-0: 120328 ppm; substance 7440-48-4: 1431 ppm;
    Precious MetalsContains precious metals [Ag, Au, Pd, Pt; at the article level]: substance 7440-22-4: 8557 ppm;
    RHF IndicatorLead-free and halogen-free according to Nexperia's halogen-free definition.
    RHF-2006 indicator DEU/CN RoHS compliantHalogen-free
    Material Material Group Substance CAS No. Mass (mg) Material (%) Product (%)
    DieDoped siliconSilicon (Si)7440-21-30.039000100.0000000.509420
    Die Total0.039000100.0000000.509420
    Lead FrameIron-nickel alloyIron (Fe)7439-89-61.22301047.98000015.975026
    Lead FrameIron-nickel alloyNickel (Ni)7440-02-00.92120936.14000012.032885
    Lead FrameIron-nickel alloyManganese (Mn)7439-96-50.0219210.8600000.286333
    Lead FrameIron-nickel alloyCobalt (Co)7440-48-40.0109610.4300000.143173
    Lead FrameIron-nickel alloySilicon (Si)7440-21-30.0066270.2600000.086562
    Lead FrameIron-nickel alloyChromium (Cr)7440-47-30.0056080.2200000.073252
    Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.0022940.0900000.029964
    Lead FrameIron-nickel alloyCarbon (C)7440-44-00.0010200.0400000.013323
    Lead FrameIron-nickel alloyPhosphorus (P)7723-14-00.0005100.0200000.006662
    Lead FrameIron-nickel alloySulfur (S)7704-34-90.0005100.0200000.006662
    Base Alloy FeNi42 Total2.19367086.06000028.653842
    Lead FramePure metal layerCopper (Cu)7440-50-80.28982111.3700003.785659
    Pre-Plating 1 Total0.28982111.3700003.785659
    Lead FramePure metal layerSilver (Ag)7440-22-40.0655092.5700000.855682
    Pre-Plating 2 Total0.0655092.5700000.855682
    Lead Frame Total2.549000100.00000033.295183
    Mould CompoundFillerSilica7631-86-93.51288072.00000045.885439
    Mould CompoundPolymero-Cresol-epichlorohydrin-formaldehyde copolymer29690-82-20.73185015.0000009.559466
    Mould CompoundPolymerFormaldehyde-phenol copolymer9003-35-40.48790010.0000006.372978
    Mould CompoundAdditiveNon-declarable0.1414922.9000001.848177
    Mould CompoundPigmentCarbon black1333-86-40.0024390.0500000.031858
    Mould CompoundAdditiveTriphenylphosphine603-35-00.0024390.0500000.031858
    Mould Compound Total4.879000100.00000063.729776
    Post-PlatingTin solderTin (Sn)7440-31-50.18488999.9400002.415031
    Post-PlatingImpurityNon-declarable0.0001030.0555000.001345
    Post-PlatingImpurityLead (Pb)7439-92-10.0000080.0045000.000105
    Post-Plating Total0.185000100.0000002.416481
    WirePure metalCopper (Cu)7440-50-80.003762100.0000000.049140
    Wire Total0.003762100.0000000.049140
    BZX84-A2V7 Total7.655762100.000000
    Notes
    Report created on 2025-12-28 18:52:43 CET+0100
    Disclaimer
    All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.
    Pb-free Soldering Pb Soldering No. of Processing Cycles
    PPT MPPT PPT MPPT
    260 °C40 s235 °C30 s3
    Notes
    Report created on 2025-12-28 18:52:43 CET+0100
    Disclaimer
    All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.
    部件名称
    Material
    有毒或有害物质和元素 (Toxic or hazardous substances and elements)
    铅 (Pb) 镉 (Cd) 汞 (Hg) 六价铬 (Cr6+) 多溴联苯 (PBB) 多溴二苯醚 (PBDE)
    半导体芯片 (Die)◯◯◯◯◯◯
    基底合金 (Base Alloy)◯◯◯◯◯◯
    预镀层1 (Pre-Plating 1)◯◯◯◯◯◯
    预镀层2 (Pre-Plating 2)◯◯◯◯◯◯
    模封料 (Mould Compound)◯◯◯◯◯◯
    后镀层 (Post-Plating)◯◯◯◯◯◯
    导线 (Wire)◯◯◯◯◯◯
    ◯ 表示该有害物质在该部件所有均质材料中的含量均在 GB/T 26572 规定的限量要求以下
    Indicates that said hazardous substance contained in all of the homogeneous materials for this part is below the limit requirement of GB/T 26572.
    ✕ 表示该有害物质至少在该部件的某一均质材料中的含量超出 GB/T 26572 规定的限量要求
    Indicates that said hazardous substance contained in at least one of the homogeneous materials used for this part is above the limit requirement of GB/T 26572.
    EFUP Icon 该半导体产品具有无限期的环保使用期限(EFUP)。
    This semiconductor product has an indefinite environmental friendly use period (EFUP).
    Notes
    Report created on 2025-12-28 18:52:43 CET+0100
    Disclaimer
    All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing locations. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents, or other industrial or intellectual property rights.

    Restricted substances declaration

    The many processes used to manufacture semiconductors are complex and delicate, and require a variety of specialized chemicals and materials. To protect our employees and the environment, we have several programs in place that regulate our use of hazardous chemicals or "substances of concern". In fact, we follow some of the toughest practical standards in the industry.

    We carefully monitor our use of substances categorized as restricted, hazardous, or relevant, and have committed, as part of our near-term Sustainability Program, to achieving a 100% reduction of all restricted and hazardous substances that aren’t critical use. We track our usage of chemicals in our company-wide Chemical Management program, which registers and classifies the chemical substances we handle. Any use or emission of restricted or hazardous substances must be covered by internal dispensation, so we are searching for alternatives as quickly as possible.

    The Nexperia List of Hazardous Substances in Products and Packaging specifies substances that are not permitted in materials, parts, semi-finished goods and products at levels above our established threshold to ensure that no Nexperia products put on the market contain any substances that are restricted by law or other regulations, including the European Union’s Directive on the restriction of the use of certain hazardous substances in electrical and electronic equipment (commonly known as RoHS).

    While most substances on this list are not permitted by law, a number of them are not permitted by Nexperia in view of upcoming legislation, their impact on the environment or on health & safety.

    The Nexperia List of Hazardous Substances in Products and Packaging also contains a number of Restricted Substances. Use of these substances is allowed, but any use of these substances must be reported above the declaration threshold as specified in this list. Most substances are placed on this list because of health risks in their use and/or processing. Others are placed on this list because they limit recycling, because they are scarce or they have for instance a high environmental impact in mining.

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