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Chemical content HEF4028BT

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Type numberPackagePackage descriptionTotal product weight
HEF4028BTSOT109-1SO16142.91115 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9333728006531212601235Suzhou, China; Bangkok, Thailand; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-42.0025080.100001.40122
PolymerResin systemProprietary0.4975019.900000.34812
subTotal2.50000100.000001.74934
DieDoped siliconSilicon (Si)7440-21-31.00098100.000000.70042
subTotal1.00098100.000000.70042
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-869.2037097.4700048.42428
Iron (Fe)7439-89-61.704002.400001.19235
Phosphorus (P)7723-14-00.021300.030000.01490
Zinc (Zn)7440-66-60.071000.100000.04968
subTotal71.00000100.0000049.68121
Mould CompoundAdditiveNon hazardousProprietary3.196004.700002.23635
FillerSilica fused60676-86-053.7200079.0000037.58979
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-84.080006.000002.85492
PigmentCarbon black1333-86-40.136000.200000.09516
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-62.720004.000001.90328
Non hazardousProprietary2.788004.100001.95086
Tetramethylbiphenyl diglycidyl ether85954-11-61.360002.000000.95164
subTotal68.00000100.0000047.58200
Pre-PlatingPure metal layerGold (Au)7440-57-50.003001.000000.00210
Nickel (Ni)7440-02-00.2910097.000000.20362
Palladium (Pd)7440-05-30.006002.000000.00420
subTotal0.30000100.000000.20992
WirePure metalCopper (Cu)7440-50-80.11016100.000000.07709
subTotal0.11016100.000000.07709
total142.91115100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.