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Chemical content HEF4043BT

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Type numberPackagePackage descriptionTotal product weight
HEF4043BTSOT109-1SO16142.85580 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9333728806531012601235Bangkok, Thailand; Nijmegen, Netherlands; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-42.0025080.100001.40176
PolymerResin systemProprietary0.4975019.900000.34825
subTotal2.50000100.000001.75001
DieDoped siliconSilicon (Si)7440-21-30.94892100.000000.66425
subTotal0.94892100.000000.66425
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-869.2037097.4700048.44305
Iron (Fe)7439-89-61.704002.400001.19281
Phosphorus (P)7723-14-00.021300.030000.01491
Zinc (Zn)7440-66-60.071000.100000.04970
subTotal71.00000100.0000049.70047
Mould CompoundAdditiveNon hazardousProprietary3.196004.700002.23722
FillerSilica fused60676-86-053.7200079.0000037.60435
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-84.080006.000002.85603
PigmentCarbon black1333-86-40.136000.200000.09520
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-62.720004.000001.90402
Non hazardousProprietary2.788004.100001.95162
Tetramethylbiphenyl diglycidyl ether85954-11-61.360002.000000.95201
subTotal68.00000100.0000047.60045
Pre-PlatingPure metal layerGold (Au)7440-57-50.003001.000000.00210
Nickel (Ni)7440-02-00.2910097.000000.20370
Palladium (Pd)7440-05-30.006002.000000.00420
subTotal0.30000100.000000.21000
WirePure metalCopper (Cu)7440-50-80.10688100.000000.07482
subTotal0.10688100.000000.07482
total142.85580100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.