Chemical content HEF4053BTT-Q100

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Type numberPackagePackage descriptionTotal product weight
HEF4053BTT-Q100SOT403-1TSSOP1660.90802 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
935300214118512601235Bangkok, Thailand; Nijmegen, Netherlands; Shanghai, China; Suzhou, China; Jiangyin, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.1324377.900000.21743
PolymerAcrylic resinProprietary0.0258415.200000.04242
Resin systemProprietary0.011736.900000.01926
DieDoped siliconSilicon (Si)7440-21-30.72115100.000001.18399
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-819.3131797.4700031.70875
Iron (Fe)7439-89-60.475552.400000.78076
Phosphorus (P)7723-14-00.005940.030000.00976
Zinc (Zn)7440-66-60.019810.100000.03253
Mould CompoundFillerSilica -amorphous-7631-86-90.237600.600000.39010
Silica fused60676-86-031.0186878.3300050.92709
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-82.415606.100003.96598
PigmentCarbon black1333-86-40.079200.200000.13003
PolymerEpoxy resin systemProprietary3.509358.862005.76172
Phenolic resinProprietary2.339575.908003.84115
Pre-PlatingPure metal layerGold (Au)7440-57-50.015093.000000.02477
Nickel (Ni)7440-02-00.4642592.300000.76222
Palladium (Pd)7440-05-30.015593.100000.02560
Silver (Ag)7440-22-40.008051.600000.01321
WirePure metalCopper (Cu)7440-50-80.09941100.000000.16321
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.