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Chemical content HEF4066BT

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Type numberPackagePackage descriptionTotal product weight
HEF4066BTSOT108-1SO14123.35265 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9333729706531212601235Shanghai, China; Nijmegen, Netherlands; Suzhou, China; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0779077.900000.06315
PolymerAcrylic resinProprietary0.0152015.200000.01232
Resin systemProprietary0.006906.900000.00559
subTotal0.10000100.000000.08106
DieDoped siliconSilicon (Si)7440-21-30.37211100.000000.30167
subTotal0.37211100.000000.30167
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-843.4131497.4700035.19433
Iron (Fe)7439-89-61.068962.400000.86659
Phosphorus (P)7723-14-00.013360.030000.01083
Zinc (Zn)7440-66-60.044540.100000.03611
subTotal44.54000100.0000036.10786
Mould CompoundAdditiveNon hazardousProprietary3.646734.700002.95635
FillerSilica fused60676-86-061.2961079.0000049.69176
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-84.655406.000003.77406
PigmentCarbon black1333-86-40.155180.200000.12580
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-63.103604.000002.51604
Non hazardousProprietary3.181194.100002.57894
Tetramethylbiphenyl diglycidyl ether85954-11-61.551802.000001.25802
subTotal77.59000100.0000062.90097
Pre-PlatingPure metal layerGold (Au)7440-57-50.006701.000000.00543
Nickel (Ni)7440-02-00.6499097.000000.52686
Palladium (Pd)7440-05-30.013402.000000.01086
subTotal0.67000100.000000.54315
WirePure metalCopper (Cu)7440-50-80.08054100.000000.06529
subTotal0.08054100.000000.06529
total123.35265100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.