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Chemical content NMUX1308BQ

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Type numberPackagePackage descriptionTotal product weight
NMUX1308BQSOT763-1DHVQFN1621.30211 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935691411115412601235Suzhou, China; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0798480.100000.37482
PolymerResin systemProprietary0.0198419.900000.09312
subTotal0.09968100.000000.46794
DieDoped siliconSilicon (Si)7440-21-30.24311100.000001.14126
subTotal0.24311100.000001.14126
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-88.0435897.4700037.75952
Iron (Fe)7439-89-60.198062.400000.92975
Phosphorus (P)7723-14-00.002480.030000.01162
Zinc (Zn)7440-66-60.008250.100000.03874
subTotal8.25236100.0000038.73963
Mould CompoundAdditiveNon hazardousProprietary0.361962.910001.69917
FillerSilica -amorphous-7631-86-90.434103.490002.03784
Silica fused60676-86-010.5503084.8200049.52703
PigmentCarbon black1333-86-40.019900.160000.09343
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.134341.080000.63062
Epoxy resin systemProprietary0.197771.590000.92841
Phenolic resinProprietary0.279872.250001.31379
Tetramethylbiphenyl diglycidyl ether85954-11-60.460223.700002.16046
subTotal12.43846100.0000058.39075
Pre-PlatingPure metal layerGold (Au)7440-57-50.002091.000000.00983
Nickel (Ni)7440-02-00.1906391.000000.89487
Palladium (Pd)7440-05-30.016768.000000.07867
subTotal0.20948100.000000.98337
WirePure metalCopper (Cu)7440-50-80.0569896.550000.26748
Pure metal layerGold (Au)7440-57-50.000210.350000.00097
Palladium (Pd)7440-05-30.001833.100000.00859
subTotal0.05902100.000000.27704
total21.30211100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.