Chemical content NPS4053GH-Q100

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Type numberPackagePackage descriptionTotal product weight
NPS4053GH-Q100SOT8044-1HWSON67.39383 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
935691531147412601235Bangkok, Thailand; Hsinchu, Taiwan; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerCopper (Cu)7440-50-80.0151825.300000.20531
Silver (Ag)7440-22-40.0303650.600000.41061
PolymerAcrylate PolymerProprietary0.0106317.720000.14380
Non hazardousProprietary0.003836.380000.05177
DieDoped siliconSilicon (Si)7440-21-30.39041100.000005.28028
Lead FrameCopper alloyCopper (Cu)7440-50-80.9610096.0995012.99726
Iron (Fe)7439-89-60.023202.320000.31378
Lead (Pb)7439-92-10.000000.000500.00007
Phosphorus (P)7723-14-00.000800.080000.01082
Zinc (Zn)7440-66-60.001200.120000.01623
Gold alloyGold (Au)7440-57-50.000250.025000.00338
Silver (Ag)7440-22-40.000250.025000.00338
ImpurityNon hazardousProprietary0.000000.000180.00002
Pure metal layerNickel (Ni)7440-02-00.012801.279870.17310
Palladium (Pd)7440-05-30.000500.049950.00676
Mould CompoundFillerSilica -amorphous-7631-86-90.408807.000005.52893
Silica fused60676-86-04.8472083.0000065.55736
PigmentCarbon black1333-86-40.029200.500000.39492
PolymerEpoxy resin systemProprietary0.350406.000004.73909
Phenolic resinProprietary0.204403.500002.76447
WireCopper alloyCopper (Cu)7440-50-80.0998596.548541.35044
ImpurityNon hazardousProprietary0.000000.000350.00000
Silver (Ag)7440-22-40.000000.001450.00002
Pure metal layerGold (Au)7440-57-50.000470.449960.00629
Palladium (Pd)7440-05-30.003102.999700.04196
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.