Chemical content NPS4053GV-Q100

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Type numberPackagePackage descriptionTotal product weight
NPS4053GV-Q100SOT457SC-7412.17341 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
935691532125512601235Bangkok, Thailand; Dongguan, China; Hsinchu, Taiwan 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0177177.000000.14548
PolymerResin systemProprietary0.0052923.000000.04346
DieDoped siliconSilicon (Si)7440-21-30.39041100.000003.20711
Lead FrameCopper alloyCopper (Cu)7440-50-84.2005595.5104034.50592
Iron (Fe)7439-89-60.095442.170000.78398
Lead (Pb)7439-92-10.000010.000300.00011
Phosphorus (P)7723-14-00.001360.031000.01120
Zinc (Zn)7440-66-60.005450.124000.04480
Pure metal layerCopper (Cu)7440-50-80.010120.230000.08309
Silver (Ag)7440-22-40.085071.934300.69882
Mould CompoundFillerSilica -amorphous-7631-86-90.9735614.000007.99743
Silica fused60676-86-04.9074470.5700040.31276
PigmentCarbon black1333-86-40.013910.200000.11425
PolymerEpoxy resin systemProprietary0.646039.290005.30687
Phenolic resinProprietary0.413075.940003.39320
Post-PlatingImpurityLead (Pb)7439-92-10.000010.004500.00011
Non hazardousProprietary0.000170.055500.00136
Tin solderTin (Sn)7440-31-50.2978299.940002.44649
WireImpurityNon hazardousProprietary0.000010.010000.00009
Pure metalCopper (Cu)7440-50-80.1099899.990000.90346
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.