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Chemical content NX138BKW

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Type numberPackagePackage descriptionTotal product weight
NX138BKWSOT323SC-705.66870 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934070157135312601235Hsin-chu, Taiwan; D-22529 HAMBURG, Germany; Seremban, Malaysia; Dongguan, China 
934070157115412601235Seremban, Malaysia; D-22529 HAMBURG, Germany; Hsin-chu, Taiwan; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.05000100.000000.88204
subTotal0.05000100.000000.88204
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.001830.090000.03226
Carbon (C)7440-44-00.000810.040000.01434
Chromium (Cr)7440-47-30.004270.210000.07528
Cobalt (Co)7440-48-40.008530.420000.15055
Iron (Fe)7439-89-60.9582947.1600016.90496
Manganese (Mn)7439-96-50.017270.850000.30469
Nickel (Ni)7440-02-00.7217735.5200012.73249
Phosphorus (P)7723-14-00.000410.020000.00717
Silicon (Si)7440-21-30.005080.250000.08961
Sulphur (S)7704-34-90.000410.020000.00717
Pure metal layerCopper (Cu)7440-50-80.2649713.040004.67431
Silver (Ag)7440-22-40.048362.380000.85313
subTotal2.03200100.0000035.84596
Mould CompoundAdditiveNon hazardousProprietary0.097732.900001.72403
Triphenylphosphine603-35-00.001680.050000.02972
FillerSilica -amorphous-7631-86-92.4264072.0000042.80346
PigmentCarbon black1333-86-40.001680.050000.02972
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.5055015.000008.91739
Phenol Formaldehyde resin (generic)9003-35-40.3370010.000005.94493
subTotal3.37000100.0000059.44925
Post-PlatingImpurityAntimony (Sb)7440-36-00.000010.003000.00011
Bismuth (Bi)7440-69-90.000000.001000.00004
Copper (Cu)7440-50-80.000000.001000.00004
Lead (Pb)7439-92-10.000010.005000.00019
Tin solderTin (Sn)7440-31-50.2099899.990003.70418
subTotal0.21000100.000003.70456
WirePure metalCopper (Cu)7440-50-80.00670100.000000.11828
subTotal0.00670100.000000.11828
total5.66870100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.