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Chemical content NXT4557GU

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Type numberPackagePackage descriptionTotal product weight
NXT4557GUSOT1160-1XQFN103.34326 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935691191115612601235Suzhou, China; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilica -amorphous-7631-86-90.0055960.000000.16726
ImpurityNon hazardousProprietary0.000000.039500.00011
PolymerResin systemProprietary0.0037239.951410.11137
subTotal0.00932100.000000.27874
DieDoped siliconSilicon (Si)7440-21-30.23352100.000006.98493
subTotal0.23352100.000006.98493
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-81.5261397.0000045.64796
Nickel (Ni)7440-02-00.047203.000001.41179
subTotal1.57333100.0000047.05975
Mould CompoundAdditiveNon hazardousProprietary0.040392.900001.20813
FillerSilica fused60676-86-01.2388988.9500037.05625
PigmentCarbon black1333-86-40.002090.150000.06249
PolymerEpoxy resin systemProprietary0.020471.470000.61240
Phenolic resinProprietary0.043323.110001.29561
Tetramethylbiphenyl diglycidyl ether85954-11-60.047633.420001.42476
subTotal1.39279100.0000041.65964
Pre-PlatingPure metal layerGold (Au)7440-57-50.000851.000000.02529
Nickel (Ni)7440-02-00.0769591.000002.30163
Palladium (Pd)7440-05-30.006768.000000.20234
subTotal0.08456100.000002.52926
WirePure metalGold (Au)7440-57-50.0492499.000001.47271
Palladium (Pd)7440-05-30.000501.000000.01488
subTotal0.04973100.000001.48759
total3.34326100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.