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Chemical content NXT4558GU-Q100

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Type numberPackagePackage descriptionTotal product weight
NXT4558GU-Q100SOT1160-1XQFN103.34355 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935691710115312601235Suzhou, China; Nijmegen, Netherlands 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilica -amorphous-7631-86-90.0055960.000000.16725
ImpurityNon hazardousProprietary0.000000.039500.00011
PolymerResin systemProprietary0.0037239.951410.11136
subTotal0.00932100.000000.27872
DieDoped siliconSilicon (Si)7440-21-30.23352100.000006.98432
subTotal0.23352100.000006.98432
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-81.5261397.0000045.64400
Nickel (Ni)7440-02-00.047203.000001.41167
subTotal1.57333100.0000047.05567
Mould CompoundAdditiveNon hazardousProprietary0.040392.900001.20802
FillerSilica fused60676-86-01.2388988.9500037.05303
PigmentCarbon black1333-86-40.002090.150000.06248
PolymerEpoxy resin systemProprietary0.020471.470000.61234
Phenolic resinProprietary0.043323.110001.29550
Tetramethylbiphenyl diglycidyl ether85954-11-60.047633.420001.42464
subTotal1.39279100.0000041.65601
Pre-PlatingPure metal layerGold (Au)7440-57-50.000851.000000.02529
Nickel (Ni)7440-02-00.0769591.000002.30143
Palladium (Pd)7440-05-30.006768.000000.20232
subTotal0.08456100.000002.52904
WirePure metalGold (Au)7440-57-50.0495399.000001.48129
Palladium (Pd)7440-05-30.000501.000000.01496
subTotal0.05003100.000001.49625
total3.34355100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.