Chemical content PBSS4360PAS-Q

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Type numberPackagePackage descriptionTotal product weight
PBSS4360PAS-QSOT1061DHUSON37.69848 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9346648851151126030 s123520 s3Dongguan, China; Seremban, Malaysia; D-22529 HAMBURG, Germany 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.001101.000000.01429
FillerSilver (Ag)7440-22-40.0924084.000001.20024
PolymerBismaleimidodiphenylmethane resin 0.0110010.000000.14289
Isobornyl Methacrylate7534-94-30.005505.000000.07144
DieDoped siliconSilicon (Si)7440-21-30.32000100.000004.15666
Lead FrameCopper alloyCopper (Cu)7440-50-82.6312793.8400034.17913
Magnesium (Mg)7439-95-40.014020.500000.18211
Nickel (Ni)7440-02-00.103753.700001.34764
Silicon (Si)7440-21-30.022430.800000.29138
Pure metal layerGold (Au)7440-57-50.001680.060000.02185
Nickel (Ni)7440-02-00.028041.000000.36423
Palladium (Pd)7440-05-30.002800.100000.03642
Mould CompoundAdditiveNon hazardousProprietary0.017470.410000.22688
FillerSilica -amorphous-7631-86-90.012350.290000.16047
Silica fused60676-86-03.6699986.1500047.67162
HardenerPhenolic resinProprietary0.182754.290002.37390
PigmentCarbon black1333-86-40.008090.190000.10514
PolymerEpoxy resin systemProprietary0.369348.670004.79760
Post-PlatingImpurityLead (Pb)7439-92-10.000010.004500.00010
Non hazardousProprietary0.000090.055500.00123
Tin solderTin (Sn)7440-31-50.1699099.940002.20690
WireImpurityNon hazardousProprietary0.000000.010000.00004
Pure metalCopper (Cu)7440-50-80.0344799.990000.44777
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.