Chemical content PBSS5240Z

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Type numberPackagePackage descriptionTotal product weight
PBSS5240ZSOT223SC-73102.49421 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
934068447115312601235D-22529 HAMBURG, Germany; Dongguan, China 
934068447135412601235Dongguan, China; D-22529 HAMBURG, Germany 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.1001077.000000.09766
PolymerResin systemProprietary0.0299023.000000.02917
DieDoped siliconSilicon (Si)7440-21-30.17000100.000000.16586
Lead FrameCopper alloyCopper (Cu)7440-50-850.7251499.1500049.49074
Iron (Fe)7439-89-60.051160.100000.04992
Phosphorus (P)7723-14-00.015350.030000.01497
Pure metal layerSilver (Ag)7440-22-40.368350.720000.35939
Mould CompoundAdditiveNon hazardousProprietary1.414912.900001.38048
FillerSilica -amorphous-7631-86-935.1288072.0000034.27394
PigmentCarbon black1333-86-40.024400.050000.02380
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-27.3185015.000007.14040
Phenol Formaldehyde resin (generic)9003-35-44.8790010.000004.76027
Post-PlatingImpurityLead (Pb)7439-92-10.000100.004500.00010
Non hazardousProprietary0.001230.055500.00120
Tin solderTin (Sn)7440-31-52.2086799.940002.15493
WireImpurityNon hazardousProprietary0.000000.010000.00000
Pure metalCopper (Cu)7440-50-80.0342199.990000.03338
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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