Chemical content PDTC114YMB

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Type numberPackagePackage descriptionTotal product weight
PDTC114YMBSOT883BXQFN30.71064 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
934065942315512601235D-22529 HAMBURG, Germany; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0022876.000000.32084
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0003110.470000.04420
Phenolic resinProprietary0.0004113.530000.05712
DieDoped siliconSilicon (Si)7440-21-30.06000100.000008.44309
Lead FrameCopper alloyChromium (Cr)7440-47-30.000670.240000.09456
Copper (Cu)7440-50-80.2632094.0000037.03704
Tin (Sn)7440-31-50.000670.240000.09456
Zinc (Zn)7440-66-60.000590.210000.08274
Pure metal layerGold (Au)7440-57-50.000220.080000.03152
Nickel (Ni)7440-02-00.013834.940001.94641
Palladium (Pd)7440-05-30.000810.290000.11426
Mould CompoundFillerSilica -amorphous-7631-86-90.0782023.0000011.00417
Silica fused60676-86-00.2040060.0000028.70652
Flame retardantMetal hydroxideProprietary0.010203.000001.43533
ImpurityBismuth (Bi)7440-69-90.001700.500000.23922
PigmentCarbon black1333-86-40.001700.500000.23922
PolymerEpoxy resin systemProprietary0.023807.000003.34909
Phenolic resinProprietary0.020406.000002.87065
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00013
Non hazardousProprietary0.000010.055500.00156
Tin solderTin (Sn)7440-31-50.0199999.940002.81268
WireImpurityNon hazardousProprietary0.000000.010000.00011
Pure metalGold (Au)7440-57-50.0076499.990001.07459
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.