×

Chemical content PESD5V0U5BF

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PESD5V0U5BFdummy POV SOT886XSON61.99328 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934061967115912601235Seremban, Malaysia; D-22529 HAMBURG, Germany; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0152076.000000.76256
PolymerFormaldehyde, polymer with (chloromethyl)oxirane and phenol9003-36-50.0020910.470000.10505
Phenolic resinProprietary0.0027113.530000.13576
subTotal0.02000100.000001.00337
DieDoped siliconSilicon (Si)7440-21-30.06000100.000003.01011
subTotal0.06000100.000003.01011
Lead FrameCopper alloyCopper (Cu)7440-50-80.7325893.9200036.75229
Magnesium (Mg)7439-95-40.001560.200000.07826
Nickel (Ni)7440-02-00.024413.130001.22482
Silicon (Si)7440-21-30.005380.690000.27001
Pure metal layerGold (Au)7440-57-50.000230.030000.01174
Nickel (Ni)7440-02-00.014511.860000.72785
Palladium (Pd)7440-05-30.001330.170000.06652
subTotal0.78000100.0000039.13149
Mould CompoundFillerSilica -amorphous-7631-86-90.2484023.0000012.46187
Silica fused60676-86-00.6480060.0000032.50923
Flame retardantMetal hydroxideProprietary0.032403.000001.62546
ImpurityBismuth (Bi)7440-69-90.005400.500000.27091
PigmentCarbon black1333-86-40.005400.500000.27091
PolymerEpoxy resin systemProprietary0.075607.000003.79274
Phenolic resinProprietary0.064806.000003.25092
subTotal1.08000100.0000054.18204
Post-PlatingImpurityLead (Pb)7439-92-10.000000.004500.00007
Non hazardousProprietary0.000020.055500.00084
Tin solderTin (Sn)7440-31-50.0299899.940001.50415
subTotal0.03000100.000001.50506
WireImpurityNon hazardousProprietary0.000000.010000.00012
Pure metalGold (Au)7440-57-50.0232899.990001.16781
subTotal0.02328100.000001.16793
total1.99328100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.