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Chemical content PMDPB58UPE

As a proactive and sustainable company, Nexperia has decided to publish chemical content information of its product portfolio through direct Internet access. With this information, we can provide data to our customers to facilitate any assessment regarding compliance to the RoHS directive and lead-free status. Nexperia has set a standard in the semiconductor business with this detailed level of data, directly retrieved from its general product database. Nexperia products are compliant to the EU Directives RoHS, ELV and the China RoHS. Please see also our Restricted Substances Declaration.

Type numberPackagePackage descriptionTotal product weight
PMDPB58UPESOT1118 dummy POVHUSON67.33677 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
9340668451154126030 s123520 s3Hsin-chu, Taiwan; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.000781.000000.01063
FillerSilver (Ag)7440-22-40.0655284.000000.89304
PolymerBismaleimidodiphenylmethane resin 0.0078010.000000.10631
Isobornyl Methacrylate7534-94-30.003905.000000.05316
subTotal0.07800100.000001.06314
DieDoped siliconSilicon (Si)7440-21-30.42000100.000005.72459
subTotal0.42000100.000005.72459
Lead FrameCopper alloyCopper (Cu)7440-50-82.5594195.1100034.88470
Magnesium (Mg)7439-95-40.005380.200000.07336
Nickel (Ni)7440-02-00.085303.170001.16270
Silicon (Si)7440-21-30.018570.690000.25308
Pure metal layerGold (Au)7440-57-50.000540.020000.00734
Nickel (Ni)7440-02-00.019910.740000.27142
Palladium (Pd)7440-05-30.001880.070000.02567
subTotal2.69100100.0000036.67827
Mould CompoundFillerSilica -amorphous-7631-86-90.7776020.0000010.59867
Silica fused60676-86-02.5077664.5000034.18071
Flame retardantMetal hydroxideProprietary0.116643.000001.58980
ImpuritySilicon Dioxide (SiO2)14808-60-70.019440.500000.26497
PigmentCarbon black1333-86-40.011660.300000.15898
PolymerPhenol Formaldehyde resin (generic)9003-35-40.085542.200001.16585
Phenolic resinProprietary0.097202.500001.32483
Tetramethylbiphenyl diglycidyl ether85954-11-60.272167.000003.70953
subTotal3.88800100.0000052.99334
Post-PlatingImpurityAntimony (Sb)7440-36-00.000020.010000.00022
Bismuth (Bi)7440-69-90.000030.020000.00045
Iron (Fe)7439-89-60.000020.010000.00022
Lead (Pb)7439-92-10.000020.010000.00022
Tin solderTin (Sn)7440-31-50.1639299.950002.23420
subTotal0.16400100.000002.23531
WireImpurityNon hazardousProprietary0.000000.010000.00001
Pure metalGold (Au)7440-57-50.0091799.990000.12495
subTotal0.00917100.000000.12496
WirePure metalGold (Au)7440-57-50.08660100.000001.18038
subTotal0.08660100.000001.18038
total7.33677100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.