Chemical content PMEG100T10ELR-Q

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Type numberPackagePackage descriptionTotal product weight
PMEG100T10ELR-QSOD123WSOD216.86000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
934662804115212601235Seremban, Malaysia; D-22529 HAMBURG, GermanyLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.35000100.000002.07592
ClipCopper alloyCopper (Cu)7440-50-83.1752399.8500018.83292
Iron (Fe)7439-89-60.003820.120000.02263
Phosphorus (P)7723-14-00.000950.030000.00566
Lead FrameCopper alloyCopper (Cu)7440-50-85.4156798.1100032.12142
Iron (Fe)7439-89-60.005520.100000.03274
Phosphorus (P)7723-14-00.001660.030000.00982
Pure metal layerSilver (Ag)7440-22-40.097151.760000.57623
Mould CompoundFillerSilica -amorphous-7631-86-90.6680010.000003.96204
Silica fused60676-86-05.0100075.0000029.71530
PigmentCarbon black1333-86-40.020040.300000.11886
PolymerEpoxy resin systemProprietary0.514367.700003.05077
Phenolic resinProprietary0.467607.000002.77343
Post-PlatingImpurityAntimony (Sb)7440-36-00.000000.003000.00003
Bismuth (Bi)7440-69-90.000000.001000.00001
Copper (Cu)7440-50-80.000000.001000.00001
Lead (Pb)7439-92-10.000010.005000.00005
Tin solderTin (Sn)7440-31-50.1599899.990000.94890
Solder PasteLead alloyLead (Pb)7439-92-10.8972592.500005.32177
Silver alloySilver (Ag)7440-22-40.024252.500000.14383
Tin alloyTin (Sn)7440-31-50.048505.000000.28766
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.