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Chemical content PMEG6030EP-Q

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Type numberPackagePackage descriptionTotal product weight
PMEG6030EP-QSOD128FlatPower33.03700 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934662860115112601235D-22529 HAMBURG, Germany; Seremban, MalaysiaLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.94000100.000002.84529
subTotal0.94000100.000002.84529
ClipCopper alloyCopper (Cu)7440-50-85.2098599.8630015.76975
Iron (Fe)7439-89-60.005160.099000.01563
Phosphorus (P)7723-14-00.001980.038000.00600
subTotal5.21700100.0000015.79138
Lead FrameCopper alloyCopper (Cu)7440-50-811.8046399.8700035.73156
Iron (Fe)7439-89-60.011230.095000.03399
Phosphorus (P)7723-14-00.004140.035000.01252
subTotal11.82000100.0000035.77807
Mould CompoundFillerSilica -amorphous-7631-86-91.2210010.000003.69586
Silica fused60676-86-09.1575075.0000027.71892
PigmentCarbon black1333-86-40.036630.300000.11088
PolymerEpoxy resin systemProprietary0.940177.700002.84581
Phenolic resinProprietary0.854707.000002.58710
subTotal12.21000100.0000036.95857
Post-PlatingImpurityAntimony (Sb)7440-36-00.000010.003000.00003
Bismuth (Bi)7440-69-90.000000.001000.00001
Copper (Cu)7440-50-80.000000.001000.00001
Lead (Pb)7439-92-10.000020.005000.00005
Tin solderTin (Sn)7440-31-50.3499699.990001.05931
subTotal0.35000100.000001.05941
Solder PasteLead alloyLead (Pb)7439-92-12.3125092.500006.99973
Silver alloySilver (Ag)7440-22-40.062502.500000.18918
Tin alloyTin (Sn)7440-31-50.125005.000000.37836
subTotal2.50000100.000007.56727
total33.03700100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.