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Chemical content PSMN4R5-80YSF

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Type numberPackagePackage descriptionTotal product weight
PSMN4R5-80YSFSOT669LFPAK89.26300 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934661575115212601260Manchester, United Kingdom; Sherman, United States Of America; Cardiff, Great Britain; Cabuyao, PhilippinesLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-34.08900100.000004.58085
subTotal4.08900100.000004.58085
ClipCopper alloyCopper (Cu)7440-50-816.7917499.8676218.81154
Iron (Fe)7439-89-60.016800.099910.01882
Phosphorus (P)7723-14-00.005460.032470.00612
subTotal16.81400100.0000018.83648
Lead FrameCopper alloyCopper (Cu)7440-50-837.8379799.8100042.38931
Iron (Fe)7439-89-60.056860.150000.06371
Phosphorus (P)7723-14-00.015160.040000.01699
subTotal37.91000100.0000042.47001
Mould CompoundFillerSilica -amorphous-7631-86-92.2290010.000002.49712
Silica fused60676-86-016.7175075.0000018.72836
PigmentCarbon black1333-86-40.066870.300000.07491
PolymerEpoxy resin systemProprietary1.716337.700001.92278
Phenolic resinProprietary1.560307.000001.74798
subTotal22.29000100.0000024.97115
Post-PlatingImpurityNon hazardousProprietary0.000380.010000.00043
Tin alloyTin (Sn)7440-31-53.8496299.990004.31267
subTotal3.85000100.000004.31310
Solder PasteImpurityAntimony (Sb)7440-36-00.000810.030000.00091
Lead alloyLead (Pb)7439-92-12.4966992.470002.79700
Silver (Ag)7440-22-40.067502.500000.07562
Tin (Sn)7440-31-50.135005.000000.15124
subTotal2.70000100.000003.02477
Solder PasteImpurityAntimony (Sb)7440-36-00.000480.030000.00054
Lead alloyLead (Pb)7439-92-11.4887792.470001.66784
Silver alloySilver (Ag)7440-22-40.040252.500000.04509
Tin alloyTin (Sn)7440-31-50.080505.000000.09018
subTotal1.61000100.000001.80365
total89.26300100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.