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Chemical content PSMN6R0-30YLD

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Type numberPackagePackage descriptionTotal product weight
PSMN6R0-30YLDSOT669LFPAK88.39000 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934067797115312601260Cabuyao, Philippines; Seremban, Malaysia; Hsin-chu, Taiwan; D-22529 HAMBURG, Germany; Shanghai, ChinaLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.74000100.000000.83720
subTotal0.74000100.000000.83720
ClipCopper alloyCopper (Cu)7440-50-819.9740099.8700022.59758
Iron (Fe)7439-89-60.020000.100000.02263
Phosphorus (P)7723-14-00.006000.030000.00679
subTotal20.00000100.0000022.62700
Lead FrameCopper alloyCopper (Cu)7440-50-837.8307699.8700042.79981
Iron (Fe)7439-89-60.037880.100000.04286
Phosphorus (P)7723-14-00.011360.030000.01286
subTotal37.88000100.0000042.85553
Mould CompoundFillerSilica fused60676-86-013.7433061.0000015.54848
Flame retardantZinc Borate138265-88-02.2530010.000002.54893
PigmentCarbon black1333-86-40.067590.300000.07647
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-24.4384119.700005.02139
Phenolic resinProprietary2.027709.000002.29404
subTotal22.53000100.0000025.48931
Post-PlatingImpurityNon hazardousProprietary0.000380.010000.00044
Tin alloyTin (Sn)7440-31-53.8496299.990004.35526
subTotal3.85000100.000004.35570
Solder PasteLead alloyLead (Pb)7439-92-13.1357592.500003.54763
Silver (Ag)7440-22-40.084752.500000.09588
Tin (Sn)7440-31-50.169505.000000.19176
subTotal3.39000100.000003.83527
total88.39000100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.