×

Chemical content PUMH13

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PUMH13SOT363SC-885.47293 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934057894135312601235Seremban, Malaysia; D-22529 HAMBURG, Germany; Dongguan, China 
9340578941151512601235Seremban, Malaysia; Dongguan, China; D-22529 HAMBURG, Germany 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-30.10000100.000001.82717
subTotal0.10000100.000001.82717
Lead FrameIron-nickel alloyAluminium (Al)7429-90-50.001860.090000.03404
Carbon (C)7440-44-00.000830.040000.01513
Chromium (Cr)7440-47-30.004350.210000.07943
Cobalt (Co)7440-48-40.008900.430000.16264
Iron (Fe)7439-89-60.9811847.4000017.92787
Manganese (Mn)7439-96-50.017600.850000.32149
Nickel (Ni)7440-02-00.7392035.7100013.50642
Phosphorus (P)7723-14-00.000410.020000.00756
Silicon (Si)7440-21-30.005380.260000.09834
Sulphur (S)7704-34-90.000410.020000.00756
Pure metal layerCopper (Cu)7440-50-80.2713813.110004.95853
Silver (Ag)7440-22-40.038501.860000.70350
subTotal2.07000100.0000037.82251
Mould CompoundFillerSilica fused60676-86-02.1929275.1000040.06848
PigmentCarbon black1333-86-40.008760.300000.16006
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.5110017.500009.33686
Phenol Formaldehyde resin (generic)9003-35-40.207327.100003.78810
subTotal2.92000100.0000053.35350
Post-PlatingImpurityAntimony (Sb)7440-36-00.000010.003000.00020
Bismuth (Bi)7440-69-90.000000.001000.00007
Copper (Cu)7440-50-80.000000.001000.00007
Lead (Pb)7439-92-10.000020.005000.00034
Tin solderTin (Sn)7440-31-50.3699699.990006.75987
subTotal0.37000100.000006.76055
WirePure metalCopper (Cu)7440-50-80.01293100.000000.23618
subTotal0.01293100.000000.23618
total5.47293100.00000100.00000
Note(s):
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.