Package information
| Package information | Package name | Package description | Reference | Date |
|---|---|---|---|---|
| SOT8025-1 | WLCSP16 | wafer level chip-scale package; 16 bumps; 1.455 mm x 1.455 mm x 0.43 mm bod | 2021-06-16 |
Boards
| Part number | Description | Type | Quick links | Shop link |
|---|---|---|---|---|
|
Description NEVB-LOGIC03 is a dual in-line logic footprint adapter board, designed to simplify the evaluation of Nexperia logic devices by offering several package footprints.
|
Type Evaluation board
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Quick links
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Shop link
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Related documents
| File name | Title | Type | Date |
|---|---|---|---|
| AN90063 | Questions about package outline drawings | Application note | 2025-10-22 |
| SOT8025-1 | 3D model for products with SOT8025-1 package | Design support | 2023-02-07 |
| SOT8025-1 | wafer level chip-scale package; 16 bumps; 1.455 mm x 1.455 mm x 0.43 mm bod | Package information | 2022-07-08 |
| SOT8025-1_336 | WLCSP16; Reel dry pack for SMD, 7"; Q1/T1 product orientation | Packing information | 2023-03-03 |
Products in this package
Analog & Logic ICs
| Type number | Description | Quick access |
|---|---|---|
| NXS0506UP | SD 3.0-compatible memory card integrated auto-direction control and level translator with EMI filter and ESD protection |