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74AUP1T34-Q100

Low-power dual supply translating buffer

The 74AUP1T34-Q100 is a single dual supply translating buffer. Input A is referenced to VCC(A) and output Y is referenced to VCC(Y). Schmitt-trigger action at all inputs makes the circuit tolerant of slower input rise and fall times. This device ensures very low static and dynamic power consumption across the entire VCC range from 1.1 V to 3.6 V. This device is fully specified for partial power down applications using IOFF. The IOFF circuitry disables the output, preventing the potentially damaging backflow current through the device when it is powered down.

This product has been qualified to the Automotive Electronics Council (AEC) standard Q100 (Grade 1) and is suitable for use in automotive applications.

Features and benefits

  • Automotive product qualification in accordance with AEC-Q100 (Grade 1)
    • Specified from -40 °C to +85 °C and -40 °C to +125 °C
  • Wide supply voltage range from 1.1 V to 3.6 V
  • High noise immunity
  • Complies with JEDEC standards:
    • JESD8-7 (1.2 V to 1.95 V)
    • JESD8-5 (1.8 V to 2.7 V)
    • JESD8-B (2.7 V to 3.6 V)
  • ESD protection:
    • MIL-STD-883, method 3015 Class 3A. Exceeds 5000 V
    • HBM JESD22-A114F Class 3A. Exceeds 5000 V
    • MM JESD22-A115-A exceeds 200 V (C = 200 pF, R = 0 Ω)
  • Wide supply voltage range:
    • VCC(A): 1.1 V to 3.6 V
    • VCC(Y): 1.1 V to 3.6 V
  • Low static power consumption; ICC = 0.9 µA (maximum)
  • Each port operates over the full 1.1 V to 3.6 V power supply range
  • Latch-up performance exceeds 100 mA per JESD 78 Class II
  • Inputs accept voltages up to 3.6 V
  • Low noise overshoot and undershoot < 10 % of VCC
  • IOFF circuitry provides partial Power-down mode operation

Parametrics

Type numberProduct statusVCC (V)Logic switching levelsOutput drive capability (mA)fmax (MHz)No of bitsPower dissipation considerationsTamb (°C)Rth(j-a) (K/W)Ψth(j-top) (K/W)Rth(j-c) (K/W)Package name
74AUP1T34GM-Q100Production1.1 - 3.6CMOS± 1.9701ultra low-40~1253238.4164XSON6
74AUP1T34GW-Q100Production1.1 - 3.6CMOS± 1.9-1ultra low-40~12529265.6165TSSOP5

Package

Type numberPackagePackage informationReflow-/Wave solderingPackingStatusMarkingOrderable part number, (Ordering code (12NC))
74AUP1T34GM-Q100
XSON6
(SOT886)
SOT886Reel 7” Q1/T1 or Q2/T3ActivepQ74AUP1T34GM-Q100X
( 9356 907 66115 )
74AUP1T34GW-Q100
TSSOP5
(SOT353-1)
SOT353-1WAVE_BG-BD-1
Reel 7" Q3/T4, ReverseActivepQ74AUP1T34GW-Q100H
( 9353 020 98125 )

Quality, reliability & chemical content

Type numberOrderable part numberChemical contentRoHS / RHFLeadfree conversion dateEFRIFRMTBF (hour)MSLMSL leadfree
74AUP1T34GM-Q10074AUP1T34GM-Q100X74AUP1T34GM-Q100week 25, 201932.60.91.11E911
74AUP1T34GW-Q10074AUP1T34GW-Q100H74AUP1T34GW-Q100Always Pb-free32.60.91.11E911
Quality and reliability disclaimer

Documentation (8)

File nameTitleTypeDate
74AUP1T34_Q100Low-power dual supply translating bufferData sheet2021-05-18
aup1t3474AUP1T34 IBIS modelIBIS model2014-12-14
Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904Leaflet2019-04-12
Nexperia_Selection_guide_2021Nexperia Selection Guide 2021Selection guide2021-01-08
SOT353-1plastic, thin shrink small outline package; 5 leads; 0.65 mm pitch; 2 mm x 1.25 mm x 0.95 mm bodyPackage information2020-04-21
WAVE_BG-BD-1Wave soldering profileWave soldering2021-09-08
SOT886plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm bodyPackage information2020-04-21
MAR_SOT886MAR_SOT886 TopmarkTop marking2013-06-03

Support

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Models

File nameTitleTypeDate
aup1t3474AUP1T34 IBIS modelIBIS model2014-12-14

Ordering, pricing & availability

Sample

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