74CBTLV3253-Q100

Dual 1-of-4 multiplexer/demultiplexer

The 74CBTLV3253-Q100 provides a dual 1-of-4 high-speed multiplexer/demultiplexer with two common select inputs (S0, S1) and two output enable inputs (1OE, 2OE). The low ON resistance of the switch allows inputs to be connected to outputs without adding propagation delay or generating additional ground bounce noise. When pin nOE = LOW, one of the four switches is selected (low-impedance ON-state) with pins S0 and S1. When pin nOE = HIGH, all switches are in the high-impedance OFF-state, independent of pins S0 and S1. To ensure the high-impedance OFF-state during power-up or power-down, nOE should be tied to the VCC through a pull-up resistor. The current-sinking capability of the driver determines the minimum value of the resistor.

Schmitt trigger action at control input makes the circuit tolerant to slower input rise and fall times across the entire VCC range from 2.3 V to 3.6 V.

This device is fully specified for partial power-down applications using IOFF. The IOFF circuitry disables the output, preventing the damaging backflow current through the device when it is powered down.

This product has been qualified to the Automotive Electronics Council (AEC) standard Q100 (Grade 1) and is suitable for use in automotive applications.

Features and benefits

  • Automotive product qualification in accordance with AEC-Q100 (Grade 1)
    • Specified from -40 °C to +85 °C and from -40 °C to +125 °C
  • Supply voltage range from 2.3 V to 3.6 V
  • High noise immunity
  • Complies with JEDEC standard:
    • JESD8-5 (2.3 V to 2.7 V)
    • JESD8-B/JESD36 (2.7 V to 3.6 V)
  • ESD protection:
    • MIL-STD-883, method 3015 exceeds 2000 V
    • HBM JESD22-A114F exceeds 2000 V
    • MM JESD22-A115-A exceeds 200 V (C = 200 pF, R = 0 Ω)
  • 5 Ω switch connection between two ports
  • Rail to rail switching on data I/O ports
  • CMOS low power consumption
  • Latch-up performance exceeds 250 mA per JESD78B Class I level A
  • IOFF circuitry provides partial Power-down mode operation
  • Multiple package options

Applications

Parametrics

Type numberProduct statusVCC (V)RON (Ω)Logic switching levelstpd (ns)Power dissipation considerationsTamb (°C)Rth(j-a) (K/W)Ψth(j-top) (K/W)Rth(j-c) (K/W)Package name
74CBTLV3253BQ-Q100Production2.3 - 3.67CMOS/LVTTL0.2very low-40~1259313.762DHVQFN16
74CBTLV3253D-Q100Production2.3 - 3.67CMOS/LVTTL0.2very low-40~125929.652SO16
74CBTLV3253PW-Q100Production2.3 - 3.67CMOS/LVTTL0.2very low-40~1251251.054.6TSSOP16

Package

Type numberPackagePackage informationReflow-/Wave solderingPackingStatusMarkingOrderable part number, (Ordering code (12NC))
74CBTLV3253BQ-Q100
DHVQFN16
(SOT763-1)
SOT763-1Reel 7” Q1/T1 or Q2/T3ActiveTV325374CBTLV3253BQ-Q10X
( 9353 013 61115 )
74CBTLV3253D-Q100
SO16
(SOT109-1)
SOT109-1SO-SOJ-REFLOW
SO-SOJ-WAVE
Reel 13" Q1/T1Active74CBTLV3253D74CBTLV3253D-Q100J
( 9353 007 71118 )
74CBTLV3253PW-Q100
TSSOP16
(SOT403-1)
SOT403-1SSOP-TSSOP-VSO-WAVE
Reel 13" Q1/T1ActiveTLV325374CBTLV3253PW-Q10J
( 9353 007 72118 )

Quality, reliability & chemical content

Type numberOrderable part numberChemical contentRoHS / RHFLeadfree conversion dateEFRMSLMSL leadfree
74CBTLV3253BQ-Q10074CBTLV3253BQ-Q10X74CBTLV3253BQ-Q100Always Pb-free144.911
74CBTLV3253D-Q10074CBTLV3253D-Q100J74CBTLV3253D-Q100Always Pb-free144.911
74CBTLV3253PW-Q10074CBTLV3253PW-Q10J74CBTLV3253PW-Q100Always Pb-free144.911
Quality and reliability disclaimer

Documentation (9)

File nameTitleTypeDate
74CBTLV3253_Q100Dual 1-of-4 multiplexer/demultiplexerData sheet2017-03-17
cbtlv3253cbtlv3253 IBIS modelIBIS model2013-04-07
Nexperia_Selection_guide_2020Nexperia Selection Guide 2020Selection guide2020-01-31
SOT763-1plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 16 terminals; 0.5 mm pitch; 3.5 mm x 2.5 mm x 1 mm bodyPackage information2020-04-21
SO-SOJ-REFLOWFootprint for reflow solderingReflow soldering2009-10-08
SO-SOJ-WAVEFootprint for wave solderingWave soldering2009-10-08
SOT109-1plastic, small outline package; 16 leads; 1.27 mm pitch; 9.9 mm x 3.9 mm x 1.35 mm bodyPackage information2020-04-21
SSOP-TSSOP-VSO-WAVEFootprint for wave solderingWave soldering2009-10-08
SOT403-1plastic, thin shrink small outline package; 16 leads; 5 mm x 4.4 mm x 1.1 mm bodyPackage information2020-04-21

Support

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Models

File nameTitleTypeDate
cbtlv3253cbtlv3253 IBIS modelIBIS model2013-04-07

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