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74AUP1G38

Low-power 2-input NAND gate (open drain)

The 74AUP1G38 provides the single 2-input NAND gate with open-drain output. The output of the device is an open drain and can be connected to other open-drain outputs to implement active-LOW wired-OR or active-HIGH wired-AND functions.

Schmitt trigger action at all inputs makes the circuit tolerant to slower input rise and fall times across the entire VCC range from 0.8 V to 3.6 V.

This device ensures a very low static and dynamic power consumption across the entire VCC range from 0.8 V to 3.6 V.

This device is fully specified for partial power-down applications using IOFF. The IOFF circuitry disables the output, preventing the damaging backflow current through the device when it is powered down.

Features and benefits

  • Wide supply voltage range from 0.8 V to 3.6 V
  • High noise immunity
  • Complies with JEDEC standards:
    • JESD8-12 (0.8 V to 1.3 V)
    • JESD8-11 (0.9 V to 1.65 V)
    • JESD8-7 (1.2 V to 1.95 V)
    • JESD8-5 (1.8 V to 2.7 V)
    • JESD8-B (2.7 V to 3.6 V)
  • ESD protection:
    • HBM JESD22-A114F Class 3A exceeds 5000 V
    • MM JESD22-A115-A exceeds 200 V
    • CDM JESD22-C101E exceeds 1000 V
  • Low static power consumption; ICC = 0.9 μA (maximum)
  • Latch-up performance exceeds 100 mA per JESD 78 Class II
  • Inputs accept voltages up to 3.6 V
  • Low noise overshoot and undershoot < 10 % of VCC
  • IOFF circuitry provides partial power-down mode operation
  • Multiple package options
  • Specified from -40 °C to +85 °C and -40 °C to +125 °C

Parametrics

Type numberProduct statusVCC (V)Logic switching levelsOutput drive capability (mA)tpd (ns)fmax (MHz)No of bitsPower dissipation considerationsTamb (°C)Rth(j-a) (K/W)Ψth(j-top) (K/W)Rth(j-c) (K/W)Package name
74AUP1G38GMProduction0.8 - 3.6CMOS1.98.5701ultra low-40~1253117.7157XSON6
74AUP1G38GNProduction0.8 - 3.6CMOS1.98.5701ultra low-40~12533422.6207XSON6
74AUP1G38GSProduction0.8 - 3.6CMOS1.98.5701ultra low-40~12532128.7215XSON6
74AUP1G38GWProduction0.8 - 3.6CMOS1.98.5701ultra low-40~12530979.2179TSSOP5
74AUP1G38GXProduction0.8 - 3.6CMOS1.98.5701ultra low-40~12532290.7191X2SON5

Package

Type numberPackagePackage informationReflow-/Wave solderingPackingStatusMarkingOrderable part number, (Ordering code (12NC))
74AUP1G38GM
XSON6
(SOT886)
SOT886Reel 7" Q1/T1, Q3/T4ActiveaB74AUP1G38GM,132
( 9352 790 32132 )
Reel 7” Q1/T1 or Q2/T3ActiveaB74AUP1G38GM,115
( 9352 790 32115 )
74AUP1G38GN
XSON6
(SOT1115)
SOT1115Reel 7" Q1/T1, Q3/T4ActiveaB74AUP1G38GN,132
( 9352 917 42132 )
74AUP1G38GS
XSON6
(SOT1202)
SOT1202Reel 7" Q1/T1, Q3/T4ActiveaB74AUP1G38GS,132
( 9352 928 66132 )
74AUP1G38GW
TSSOP5
(SOT353-1)
SOT353-1WAVE_BG-BD-1
Reel 7" Q3/T4, ReverseActiveaB74AUP1G38GW,125
( 9352 790 31125 )
74AUP1G38GX
X2SON5
(SOT1226)
SOT1226Reel 7" Q3/T4, ReverseActiveaB74AUP1G38GX,125
( 9352 983 64125 )

Quality, reliability & chemical content

Type numberOrderable part numberChemical contentRoHS / RHFLeadfree conversion dateEFRIFRMTBF (hour)MSLMSL leadfree
74AUP1G38GM74AUP1G38GM,13274AUP1G38GMAlways Pb-free32.60.91.11E911
74AUP1G38GM74AUP1G38GM,11574AUP1G38GMAlways Pb-free32.60.91.11E911
74AUP1G38GN74AUP1G38GN,13274AUP1G38GNAlways Pb-free32.60.91.11E911
74AUP1G38GS74AUP1G38GS,13274AUP1G38GSAlways Pb-free32.60.91.11E911
74AUP1G38GW74AUP1G38GW,12574AUP1G38GWAlways Pb-free32.60.91.11E911
74AUP1G38GX74AUP1G38GX,12574AUP1G38GXAlways Pb-free32.60.91.11E911
Quality and reliability disclaimer

Documentation (17)

File nameTitleTypeDate
74AUP1G38Low-power 2-input NAND-gate (open drain)Data sheet2017-03-17
AN10161PicoGate Logic footprintsApplication note2002-10-29
AN11052Pin FMEA for AUP familyApplication note2019-01-09
aup1g3874AUP1G38 IBIS modelIBIS model2014-12-14
Nexperia_document_leaflet_Logic_X2SON_packages_062018X2SON ultra-small 4, 5, 6 & 8-pin leadless packagesLeaflet2018-06-05
Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904Leaflet2019-04-12
Nexperia_Selection_guide_2022Nexperia Selection Guide 2022Selection guide2022-01-05
SOT1202plastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1mm x 0.35 mm bodyPackage information2020-04-21
MAR_SOT1202MAR_SOT1202 TopmarkTop marking2013-06-03
WAVE_BG-BD-1Wave soldering profileWave soldering2021-09-08
SOT353-1plastic thin shrink small outline package; 5 leads; body width 1.25 mmPackage information2022-01-06
MAR_SOT1115MAR_SOT1115 TopmarkTop marking2013-06-03
SOT1115plastic, leadless extremely thin small outline package; 6 terminals; 0.3 mm pitch; 0.9 mm x 1 mm x 0.35 mm bodyPackage information2021-07-12
SOT1226plastic, leadless thermal enhanced extremely thin small outline package; no leads; 5 terminals; 0.48 mm pitch; 0.8 mm x 0.8 mm x 0.35 mm bodyPackage information2020-04-21
MAR_SOT1226MAR_SOT1226 TopmarkTop marking2013-06-03
SOT886plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm bodyPackage information2020-04-21
MAR_SOT886MAR_SOT886 TopmarkTop marking2013-06-03

Support

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Models

File nameTitleTypeDate
aup1g3874AUP1G38 IBIS modelIBIS model2014-12-14

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