Features and benefits
- Wide supply voltage range from 0.8 V to 3.6 V
- CMOS low power dissipation
- High noise immunity
- Complies with JEDEC standards:
- JESD8-12 (0.8 V to 1.3 V)
- JESD8-11 (0.9 V to 1.65 V)
- JESD8-7 (1.65 V to 1.95 V)
- JESD8-5 (2.3 V to 2.7 V)
- JESD8C (2.7 V to 3.6 V)
- ESD protection:
- HBM JESD22-A114F Class 3A exceeds 5000 V
- MM JESD22-A115-A exceeds 200 V
- CDM JESD22-C101E exceeds 1000 V
- Low static power consumption; ICC = 0.9 μA (maximum)
- Latch-up performance exceeds 100 mA per JESD 78 Class II
- Overvoltage tolerant inputs to 3.6 V
- Low noise overshoot and undershoot < 10 % of VCC
- IOFF circuitry provides partial Power-down mode operation
- Multiple package options
- Specified from -40 °C to +85 °C and -40 °C to +125 °C
Parametrics
| Type number | Product status | VCC (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | fmax (MHz) | Nr of bits | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 74AUP1G38GM | Production | 0.8 - 3.6 | CMOS | 1.9 | 8.5 | 70 | 1 | ultra low | -40~125 | 311 | 7.7 | 157 | XSON6 |
| 74AUP1G38GN | Production | 0.8 - 3.6 | CMOS | 1.9 | 8.5 | 70 | 1 | ultra low | -40~125 | 334 | 22.6 | 207 | XSON6 |
| 74AUP1G38GS | Production | 0.8 - 3.6 | CMOS | 1.9 | 8.5 | 70 | 1 | ultra low | -40~125 | 321 | 28.7 | 215 | XSON6 |
| 74AUP1G38GW | Production | 0.8 - 3.6 | CMOS | 1.9 | 8.5 | 70 | 1 | ultra low | -40~125 | 309 | 79.2 | 179 | TSSOP5 |
| 74AUP1G38GX | Production | 0.8 - 3.6 | CMOS | 1.9 | 8.5 | 70 | 1 | ultra low | -40~125 | 322 | 90.7 | 191 | X2SON5 |
Package
| Type number | Package | Package information | Reflow-/Wave soldering | Packing | Status | Marking | Orderable part number, (Ordering code (12NC)) |
|---|---|---|---|---|---|---|---|
| 74AUP1G38GM |  XSON6 (SOT886) | SOT886 | Reel 7" Q1/T1, Q3/T4 | Active | aB | 74AUP1G38GM,132 ( 9352 790 32132 ) | |
| Reel 7” Q1/T1 or Q2/T3 | Active | aB | 74AUP1G38GM,115 ( 9352 790 32115 ) | ||||
| 74AUP1G38GN |  XSON6 (SOT1115) | SOT1115 | Reel 7" Q1/T1, Q3/T4 | Active | aB | 74AUP1G38GN,132 ( 9352 917 42132 ) | |
| 74AUP1G38GS |  XSON6 (SOT1202) | SOT1202 | Reel 7" Q1/T1, Q3/T4 | Active | aB | 74AUP1G38GS,132 ( 9352 928 66132 ) | |
| 74AUP1G38GW |  TSSOP5 (SOT353-1) | SOT353-1 | WAVE_BG-BD-1 | Reel 7" Q3/T4, Reverse | Active | aB | 74AUP1G38GW,125 ( 9352 790 31125 ) |
| 74AUP1G38GX |  X2SON5 (SOT1226) | SOT1226 | Reel 7" Q3/T4, Reverse | Active | aB | 74AUP1G38GX,125 ( 9352 983 64125 ) |
Quality, reliability & chemical content
| Type number | Orderable part number | Chemical content | RoHS / RHF | Leadfree conversion date | MSL | MSL leadfree |
|---|---|---|---|---|---|---|
| 74AUP1G38GM | 74AUP1G38GM,132 | 74AUP1G38GM |   | Always Pb-free | 1 | 1 |
| 74AUP1G38GM | 74AUP1G38GM,115 | 74AUP1G38GM | | Always Pb-free | 1 | 1 |
| 74AUP1G38GN | 74AUP1G38GN,132 | 74AUP1G38GN | | Always Pb-free | 1 | 1 |
| 74AUP1G38GS | 74AUP1G38GS,132 | Not available You can request this via a support request | | Always Pb-free | 1 | 1 |
| 74AUP1G38GW | 74AUP1G38GW,125 | 74AUP1G38GW | | Always Pb-free | 1 | 1 |
| 74AUP1G38GX | 74AUP1G38GX,125 | 74AUP1G38GX | | Always Pb-free | 1 | 1 |
Documentation (17)
| File name | Title | Type | Date |
|---|---|---|---|
| 74AUP1G38 | Low-power 2-input NAND gate (open drain) | Data sheet | 2022-02-07 |
| AN10161 | PicoGate Logic footprints | Application note | 2002-10-29 |
| AN11052 | Pin FMEA for AUP family | Application note | 2019-01-09 |
| aup1g38 | 74AUP1G38 IBIS model | IBIS model | 2014-12-14 |
| Nexperia_document_leaflet_Logic_X2SON_packages_062018 | X2SON ultra-small 4, 5, 6 & 8-pin leadless packages | Leaflet | 2018-06-05 |
| Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904 | Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904 | Leaflet | 2019-04-12 |
| Nexperia_Selection_guide_2022 | Nexperia Selection Guide 2022 | Selection guide | 2022-01-05 |
| SOT1202 | plastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1mm x 0.35 mm body | Package information | 2020-04-21 |
| MAR_SOT1202 | MAR_SOT1202 Topmark | Top marking | 2013-06-03 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
| SOT353-1 | plastic thin shrink small outline package; 5 leads; body width 1.25 mm | Package information | 2022-01-06 |
| MAR_SOT1115 | MAR_SOT1115 Topmark | Top marking | 2013-06-03 |
| SOT1115 | plastic, leadless extremely thin small outline package; 6 terminals; 0.3 mm pitch; 0.9 mm x 1 mm x 0.35 mm body | Package information | 2021-07-12 |
| SOT1226 | plastic, leadless thermal enhanced extremely thin small outline package; no leads; 5 terminals; 0.48 mm pitch; 0.8 mm x 0.8 mm x 0.35 mm body | Package information | 2020-04-21 |
| MAR_SOT1226 | MAR_SOT1226 Topmark | Top marking | 2013-06-03 |
| SOT886 | plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm body | Package information | 2020-04-21 |
| MAR_SOT886 | MAR_SOT886 Topmark | Top marking | 2013-06-03 |
Support
If you are in need of design/technical support, let us know and fill in the answer form, we'll get back to you shortly.
Models
| File name | Title | Type | Date |
|---|---|---|---|
| aup1g38 | 74AUP1G38 IBIS model | IBIS model | 2014-12-14 |
Ordering, pricing & availability
Sample
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