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DHXQFN

Smallest and lowest profile 14, 16, 20 and 24 pin packages for standard logic devices

Nexperia's DHXQFN is the industry's smallest footprint package in 14, 16, 20 and 24 pin and offers significant space saving on PCB. The small footprint of DHXQFN package enables devices to be placed closer to the bypass capacitor. This can be a significant advantage in designs with limited board space for glue logic parts, and also results in increased performance in high frequency applications since the traces between logic device and capacitor are shorter.

Key features and benefits

  • Smallest and thinnest package in 14, 16, 20 and 24.
  • Significant space savings up to 25% on a PCB area compare to competitors’ packages (16 pin package as a reference).
  • 45% of space saving compare to industry standard DQFN package (16 pin package as a reference).
  • Small footprint and thinness of the package make it conducive for space constrained applications.
  • Delivers better performance due to closer placement of supply bypass capacitor C.
  • Control plan in place for process, product & package
  • RoHS and dark-green compliant

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DHXQFN
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Products

Analog & Logic ICs

Type number Description Status Quick access
74AVC4T245BZ 4-bit dual supply translating transceiver with configurable voltage translation; 3-state Production
74AVC8T245BZ 8-bit dual supply translating transceiver with configurable voltage translation; 3-state Production
74HC595BZ 8-bit serial-in, serial or parallel-out shift register with output latches; 3-state Production
74LV14ABZ Hex inverting Schmitt trigger Production
74LVC14ABZ Hex inverting Schmitt trigger with 5 V tolerant input Production
74LVC244ABZ Octal buffer/line driver; 3-state Production
74LVC245ABZ Octal bus transceiver; 3-state Production
74LVC8T245BZ 8-bit dual supply translating transceiver; 3-state Production

Documentation

File name Title Type Date
sot8014-1_3d DHXQFN14: plastic, leadless dual in-line compatible thermal enhanced extreme thin quad flat package; no leads; 14 terminals; 0.4 mm pitch; body 2 mm x 2 mm x 0.48 mm Outline 3d 2021-06-10
SOT8014-1 plastic, leadless dual in-line compatible thermal enhanced extreme thin quad flat package;no leads; 14 terminals; 0.4 mm pitch; body 2 mm x 2 mm x 0.48 mm Package information 2020-11-09
SOT8016-1 plastic, leadless dual in-line compatible thermal enhanced extreme thin quad flat package;no leads; 16 terminals; 0.4 mm pitch; body 2 mm x 2.4 mm x 0.48 mm Package information 2020-11-09
SOT8020-1 plastic, leadless dual in-line compatible thermal enhanced extreme thin quad flat package;no leads; 20 terminals; 0.4 mm pitch; body 2 mm x 3.2 mm x 0.48 mm Package information 2021-09-15
SOT8024-1 plastic, leadless dual in-line compatible thermal enhanced extreme thin quad flat package;no leads; 24 terminals; 0.4 mm pitch; body 2 mm x 4 mm x 0.48 mm Package information 2021-09-15
2021-0002_NEX_083_DHXQFN_Leaflet_v05 Industry’s smallest and thinnest package in 14, 16, 20 and 24 pins for Standard Logic functions Leaflet 2021-06-29

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Datasheets (8)

File name Title Type Date
74AVC4T245 4-bit dual supply translating transceiver with configurable voltage translation; 3-state Data sheet 2021-04-29
74AVC8T245 8-bit dual supply translating transceiver with configurable voltage translation; 3-state Data sheet 2021-04-29
74HC_HCT595 8-bit serial-in, serial or parallel-out shift register with output latches; 3-state Data sheet 2021-09-10
74LV14A Hex inverting Schmitt trigger Data sheet 2021-04-29
74LVC14A Hex inverting Schmitt trigger with 5 V tolerant input Data sheet 2021-09-20
74LVC_LVCH244A Octal buffer/line driver; 3-state Data sheet 2021-09-16
74LVC_LVCH245A Octal bus transceiver; 3-state Data sheet 2021-09-16
74LVC_LVCH8T245 8-bit dual supply translating transceiver; 3-state Data sheet 2021-04-29