Key features and benefits
- Smallest and thinnest package in 14, 16, 20 and 24.
- Significant space savings up to 25% on a PCB area compare to competitors’ packages (16 pin package as a reference).
- 45% of space saving compare to industry standard DQFN package (16 pin package as a reference).
- Small footprint and thinness of the package make it conducive for space constrained applications.
- Delivers better performance due to closer placement of supply bypass capacitor C.
- Control plan in place for process, product & package
- RoHS and dark-green compliant
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DHXQFN
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Products
Analog & Logic ICs
| Type number | Description | Status | Quick access |
|---|---|---|---|
| 74AVC4T245BZ | 4-bit dual supply translating transceiver with configurable voltage translation; 3-state | Production | |
| 74LVC8T245BZ | 8-bit dual supply translating transceiver; 3-state | Production | |
| 74AVC8T245BZ | 8-bit dual supply translating transceiver with configurable voltage translation; 3-state | Production | |
| 74HC595BZ | 8-bit serial-in, serial or parallel-out shift register with output latches; 3-state | Production | |
| 74LVC14ABZ | Hex inverting Schmitt trigger with 5 V tolerant input | Production | |
| 74LVC244ABZ | Octal buffer/line driver; 3-state | Production | |
| 74LVC245ABZ | Octal bus transceiver; 3-state | Production | |
| 74LV14ABZ | Hex inverting Schmitt trigger | Production |
Documentation
| File name | Title | Type | Date |
|---|---|---|---|
| sot8014-1_3d.png | DHXQFN14: plastic, leadless dual in-line compatible thermal enhanced extreme thin quad flat package; no leads; 14 terminals; 0.4 mm pitch; body 2 mm x 2 mm x 0.48 mm | Outline 3d | 2021-06-10 |
| 2021-0002_NEX_083_DHXQFN_Leaflet_v05.pdf | Industry’s smallest and thinnest package in 14, 16, 20 and 24 pins for Standard Logic functions | Leaflet | 2021-06-29 |
| SOT8016-1.pdf | plastic, leadless dual in-line compatible thermal enhanced extreme thin quad flat package;no leads; 16 terminals; 0.4 mm pitch; body 2 mm x 2.4 mm x 0.48 mm | Package information | 2023-02-03 |
| SOT8014-1.pdf | plastic, leadless dual in-line compatible thermal enhanced extreme thin quad flat package;no leads; 14 terminals; 0.4 mm pitch; body 2 mm x 2 mm x 0.48 mm | Package information | 2023-02-28 |
| SOT8020-1.pdf | plastic, leadless dual in-line compatible thermal enhanced extreme thin quad flat package;no leads; 20 terminals; 0.4 mm pitch; body 2 mm x 3.2 mm x 0.48 mm | Package information | 2023-02-28 |
| SOT8024-1.pdf | plastic, leadless dual in-line compatible thermal enhanced extreme thin quad flat package;no leads; 24 terminals; 0.4 mm pitch; body 2 mm x 4 mm x 0.48 mm | Package information | 2023-02-28 |
| vp_DHXQFN.zip | DHXQFN | Value proposition | 2024-10-04 |
| DHXQFN14_SOT814-1_mk.png | DHXQFN14 MARCOM image | Marcom graphics | 2025-03-11 |
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