Package information
| Package information | Package name | Package description | Reference | Date |
|---|---|---|---|---|
| SOT8020-1 | DHXQFN20 | plastic, leadless dual in-line compatible thermal enhanced extreme thin quad flat package; no leads; 20 terminals; 0.4 mm pitch; body 2 mm x 3.2 mm x 0.48 mm | 2020-09-22 |
Boards
| Part number | Description | Type | Quick links | Shop link |
|---|---|---|---|---|
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Description NEVB-LOGIC04 is a dual in-line logic footprint adapter board, designed to simplify the evaluation of Nexperia logic devices by offering several package footprints.
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Type Evaluation board
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Quick links
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Shop link
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Related documents
| File name | Title | Type | Date |
|---|---|---|---|
| AN90063 | Questions about package outline drawings | Application note | 2025-10-22 |
| SOT8020-1 | 3D model for products with SOT8020-1 package | Design support | 2023-02-02 |
| SOT8020-1 | plastic, leadless dual in-line compatible thermal enhanced extreme thin quad flat package;no leads; 20 terminals; 0.4 mm pitch; body 2 mm x 3.2 mm x 0.48 mm | Package information | 2023-02-28 |
| SOT8020-1_115 | DHXQFN20; Reel pack for SMD, 7''; Q1/T1 product orientation | Packing information | 2025-10-27 |
Products in this package
Analog & Logic ICs
| Type number | Description | Quick access |
|---|---|---|
| 74HC245BZ | Octal bus transceiver; 3-state | |
| 74LVC244ABZ | Octal buffer/line driver; 3-state | |
| 74LVC245ABZ | Octal bus transceiver; 3-state | |
| 74HCT245BZ | Octal bus transceiver; 3-state |