74HCS273-Q100
Octal D-type flip-flop with reset and Schmitt-trigger inputs; positive-edge trigger
The 74HCS273-Q100 is an octal positive-edge triggered D-type flip-flop. The device features clock (CP) and master reset (MR) inputs. The outputs Qn will assume the state of their corresponding Dn inputs that meet the set-up and hold time requirements on the LOW-to-HIGH clock (CP) transition. A LOW on MR forces the outputs LOW independently of clock and data inputs. Inputs include clamp diodes. This enables the use of current limiting resistors to interface inputs to voltages in excess of VCC.
All inputs are Schmitt-trigger inputs, capable of transforming slowly changing input signals into sharply defined, jitter-free output signals.
This product has been qualified to the Automotive Electronics Council (AEC) standard Q100 (Grade 1) and is suitable for use in automotive applications.
Features and benefits
Automotive product qualification in accordance with AEC-Q100 (Grade 1)
Specified from -40 °C to +85 °C and from -40 °C to +125 °C
Wide supply voltage range from 2.0 V to 6.0 V
Schmitt-trigger inputs
Common clock and master reset
Eight positive edge-triggered D-type flip-flops
- Low power consumption
- Typical supply current (ICC) of 100 nA
- Typical input leakage current (II) of ±10 nA
- ±7.8 mA output drive at 6 V
- Latch-up performance exceeds 100 mA per JESD 78 Class II Level B
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Complies with JEDEC standards:
- JESD7A (2.0 V to 6.0 V)
ESD protection:
HBM ANSI/ESDA/JEDEC JS-001 class 3A exceeds 4000 V
CDM ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1500 V
Multiple package options
DHVQFN package with Side-Wettable Flanks enabling Automated Optical Inspection (AOI) of solder joints
Parametrics
| Type number | VCC (V) | Logic switching levels | Power dissipation considerations | Tamb (°C) | Package name |
|---|---|---|---|---|---|
| 74HCS273BQ-Q100 | 2.0 - 6.0 | CMOS | low | -40~125 | DHVQFN20 |
| 74HCS273PW-Q100 | 2.0 - 6.0 | CMOS | low | -40~125 | TSSOP20 |
Package
| Type number | Orderable part number, (Ordering code (12NC)) | Status | Marking | Package | Package information | Reflow-/Wave soldering | Packing |
|---|---|---|---|---|---|---|---|
| 74HCS273BQ-Q100 | 74HCS273BQ-Q100X (935692459115) |
Development | S273 |
DHVQFN20 (SOT764-1) |
SOT764-1 | SOT764-1_115 | |
| 74HCS273PW-Q100 | 74HCS273PW-Q100J (935692457118) |
Development | S273 |
TSSOP20 (SOT360-1) |
SOT360-1 |
SSOP-TSSOP-VSO-WAVE
|
SOT360-1_118 |
Environmental information
| Type number | Orderable part number | Chemical content | RoHS | RHF-indicator |
|---|---|---|---|---|
| 74HCS273BQ-Q100 | 74HCS273BQ-Q100X | 74HCS273BQ-Q100 |
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| 74HCS273PW-Q100 | 74HCS273PW-Q100J | 74HCS273PW-Q100 |
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Documentation (11)
| File name | Title | Type | Date |
|---|---|---|---|
| 74HCS273_Q100 | Octal D-type flip-flop with reset and Schmitt-trigger inputs; positive-edge trigger | Data sheet | 2025-10-31 |
| AN90063 | Questions about package outline drawings | Application note | 2025-10-22 |
| SOT764-1 | 3D model for products with SOT764-1 package | Design support | 2019-10-03 |
| SOT360-1 | 3D model for products with SOT360-1 package | Design support | 2020-01-22 |
| 74hcs273 | 74HCS273 IBIS model | IBIS model | 2025-11-04 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| DHVQFN20_SOT764-1_mk | plastic, dual in-line compatible thermal enhanced very thin quad flat package; 20 terminals; 0.5 mm pitch; 2.5 mm x 4.5 mm x 0.85 mm body | Marcom graphics | 2017-01-28 |
| TSSOP20_SOT360-1_mk | plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.1 mm body | Marcom graphics | 2017-01-28 |
| SOT764-1 | plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 20 terminals; 0.5 mm pitch; 4.5 mm x 2.5 mm x 1 mm body | Package information | 2022-06-21 |
| SOT360-1 | plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.2 mm body | Package information | 2024-11-15 |
| SSOP-TSSOP-VSO-WAVE | Footprint for wave soldering | Wave soldering | 2009-10-08 |
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