Features and benefits
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Automotive product qualification in accordance with AEC-Q100 (Grade 1)
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Specified from -40 °C to +85 °C and from -40 °C to +125 °C
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Wide supply voltage range from 2.0 V to 6.0 V
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CMOS low power dissipation
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High noise immunity
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Symmetrical output impedance
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Balanced propagation delays
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Latch-up performance exceeds 100 mA per JESD 78 Class II Level B
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Input levels:
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For 74HC1G08-Q100: CMOS level
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For 74HCT1G08-Q100: TTL level
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Complies with JEDEC standards:
- JESD8C (2.7 V to 3.6 V)
- JESD7A (2.0 V to 6.0 V)
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ESD protection:
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MIL-STD-883, method 3015 exceeds 2000 V
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HBM JESD22-A114F exceeds 2000 V
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MM JESD22-A115-A exceeds 200 V (C = 200 pF, R = 0 Ω)
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Parametrics
| Type number | Product status | VCC (V) | Logic switching levels | Output drive capability (mA) | tpd (ns) | fmax (MHz) | Nr of bits | Power dissipation considerations | Tamb (°C) | Rth(j-a) (K/W) | Ψth(j-top) (K/W) | Rth(j-c) (K/W) | Package name |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| 74HC1G08GV-Q100 | Production | 2.0 - 6.0 | CMOS | ± 5.2 | 7 | 36 | 1 | low | -40~125 | 220 | 33.0 | 131 | TSOP5 |
| 74HC1G08GW-Q100 | Production | 2.0 - 6.0 | CMOS | ± 5.2 | 7 | 36 | 1 | low | -40~125 | 261 | 39.3 | 138 | TSSOP5 |
| 74HCT1G08GV-Q100 | Production | 4.5 - 5.5 | TTL | ± 2 | 11 | 36 | 1 | low | -40~125 | 220 | 33.0 | 131 | TSOP5 |
| 74HCT1G08GW-Q100 | Production | 4.5 - 5.5 | TTL | ± 2 | 11 | 36 | 1 | low | -40~125 | 261 | 39.3 | 138 | TSSOP5 |
Package
| Type number | Package | Package information | Reflow-/Wave soldering | Packing | Status | Marking | Orderable part number, (Ordering code (12NC)) |
|---|---|---|---|---|---|---|---|
| 74HC1G08GV-Q100 |  TSOP5 (SOT753) | SOT753 | REFLOW_BG-BD-1 WAVE_BG-BD-1 | SOT753_125 | Active | H08 | 74HC1G08GV-Q100,12 ( 9352 984 84125 ) |
| 74HC1G08GW-Q100 |  TSSOP5 (SOT353-1) | SOT353-1 | WAVE_BG-BD-1 | SOT353-1_125 | Active | HE | 74HC1G08GW-Q100,12 ( 9352 984 85125 ) |
| 74HCT1G08GV-Q100 | TSOP5 (SOT753) | SOT753 | REFLOW_BG-BD-1 WAVE_BG-BD-1 | SOT753_125 | Active | T08 | 74HCT1G08GV-Q100,1 ( 9352 984 86125 ) |
| 74HCT1G08GW-Q100 | TSSOP5 (SOT353-1) | SOT353-1 | WAVE_BG-BD-1 | SOT353-1_125 | Active | TE | 74HCT1G08GW-Q100,1 ( 9352 984 87125 ) |
Environmental information
| Type number | Orderable part number | Chemical content | RoHS | RHF-indicator | Leadfree conversion date |
|---|---|---|---|---|---|
| 74HC1G08GV-Q100 | 74HC1G08GV-Q100,12 | 74HC1G08GV-Q100 |  |   | Always Pb-free |
| 74HC1G08GW-Q100 | 74HC1G08GW-Q100,12 | 74HC1G08GW-Q100 | | | Always Pb-free |
| 74HCT1G08GV-Q100 | 74HCT1G08GV-Q100,1 | 74HCT1G08GV-Q100 | | | Always Pb-free |
| 74HCT1G08GW-Q100 | 74HCT1G08GW-Q100,1 | 74HCT1G08GW-Q100 | | | Always Pb-free |
Documentation (11)
| File name | Title | Type | Date |
|---|---|---|---|
| 74HC_HCT1G08_Q100 | 2-input AND gate | Data sheet | 2022-02-01 |
| AN10161 | PicoGate Logic footprints | Application note | 2002-10-29 |
| AN11044 | Pin FMEA 74HC/74HCT family | Application note | 2019-01-09 |
| hct1g08 | 74HCT1G08 IBIS model | IBIS model | 2019-01-09 |
| hc1g08 | 74HC1G08 IBIS model | IBIS model | 2022-12-21 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
| SOT353-1 | plastic thin shrink small outline package; 5 leads; body width 1.25 mm | Package information | 2022-11-15 |
| MAR_SOT753 | MAR_SOT753 Topmark | Top marking | 2013-06-03 |
| SOT753 | plastic, surface-mounted package; 5 leads; 0.95 mm pitch; 2.9 mm x 1.5 mm x 1 mm body | Package information | 2022-05-31 |
| REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
Support
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Ordering, pricing & availability
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