N-channel 30 V, 4.0 mΩ logic level MOSFET in LFPAK56 using NextPowerS3 Technology
Buy from Nexperia
| SKU | Stock* | MOQ | Price per unit** | Quantity |
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Buy from distributors
| Seller | SKU | Stock | MOQ | 1 | 10 | 100 | 1,000 | 10,000 | Purchase |
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| Seller | SKU | Stock | MOQ | 1 | 10 | 100 | 1,000 | 10,000 | Purchase |
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| Seller | SKU | Stock | MOQ | 1 | 10 | 100 | 1,000 | 10,000 | Purchase |
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| Seller | SKU | Stock | MOQ | 1 | 10 | 100 | 1,000 | 10,000 | Purchase |
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| Seller | SKU | Stock | MOQ | 1 | 10 | 100 | 1,000 | 10,000 | Purchase |
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** Displayed price per unit is based on small quantity orders
*** Authorized resellers for overstock, mature, and discontinued products which are warranted for reliability by the reseller, no longer by Nexperia
Features and benefits
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Ultra low QG, QGD and QOSS for high system efficiency, especially at higher switching frequencies
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Superfast switching with soft-recovery; s-factor > 1
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Low spiking and ringing for low EMI designs
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Unique “SchottkyPlus” technology; Schottky-like performance with < 1 µA leakage at 25 °C
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Optimised for 4.5 V gate drive
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Low parasitic inductance and resistance
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High reliability clip bonded and solder die attach Power SO8 package; no glue, no wire bonds, qualified to 175 °C
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Wave solderable; exposed leads for optimal visual solder inspection
Applications
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On-board DC-to-DC solutions for server and telecommunications
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Secondary-side synchronous rectification in telecommunication applications
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Voltage regulator modules (VRM)
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Point-of-Load (POL) modules
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Power delivery for V-core, ASIC, DDR, GPU, VGA and system components
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Brushed and brushless motor control
Parametrics
| Type number | Package version | Package name | Product status | Channel type | Nr of transistors | VDS [max] (V) | RDSon [max] @ VGS = 10 V (mΩ) | RDSon [max] @ VGS = 4.5 V (mΩ) | Tj [max] (°C) | ID [max] (A) | QGD [typ] (nC) | QG(tot) [typ] @ VGS = 4.5 V (nC) | QG(tot) [typ] @ VGS = 10 V (nC) | Ptot [max] (W) | Qr [typ] (nC) | VGSth [typ] (V) | Automotive qualified | Ciss [typ] (pF) | Coss [typ] (pF) | Date |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
| PSMN4R0-30YLD | SOT669 | LFPAK56; Power-SO8 | Production | N | 1 | 30 | 4 | 5.5 | 175 | 95 | 2.9 | 9.6 | 20.5 | 64 | 13.3 | 1.74 | N | 1272 | 812 | 2013-06-26 |
PCB Symbol, Footprint and 3D Model
| Model Name | Description |
|---|---|
Package
| Type number | Orderable part number, (Ordering code (12NC)) | Status | Marking | Package | Package information | Reflow-/Wave soldering | Packing |
|---|---|---|---|---|---|---|---|
| PSMN4R0-30YLD | PSMN4R0-30YLDX ( 9340 677 96115 ) | Active | 4D030L |  LFPAK56; Power-SO8 (SOT669) | SOT669 | REFLOW_BG-BD-1 WAVE_BG-BD-1 | SOT669_115 |
Environmental information
| Type number | Orderable part number | Chemical content | RoHS | RHF-indicator |
|---|---|---|---|---|
| PSMN4R0-30YLD | PSMN4R0-30YLDX | PSMN4R0-30YLD |  |  |
Documentation (14)
| File name | Title | Type | Date |
|---|---|---|---|
| PSMN4R0-30YLD | N-channel 30 V, 4.0 mΩ logic level MOSFET in LFPAK56 using NextPowerS3 Technology | Data sheet | 2018-04-02 |
| AN11261 | RC Thermal Models | Application note | 2021-03-18 |
| AN11599 | Using power MOSFETs in parallel | Application note | 2016-07-13 |
| AN10874_ZH | LFPAK MOSFET thermal design guide, Chinese version | Application note | 2020-04-30 |
| AN11113_ZH | LFPAK MOSFET thermal design guide - Part 2 | Application note | 2020-04-30 |
| Reliability_information_t9_sot669 | Reliability information t9_sot669 | Quality document | 2022-10-18 |
| T9_SOT669_PSMN4R0-30YLD_Nexperia_Quality_document | PSMN4R0-30YLD Quality document | Quality document | 2022-10-18 |
| PSMN4R0-30YLD | PSMN4R0-30YLD Spice model | SPICE model | 2013-09-17 |
| TN00008 | Power MOSFET frequently asked questions and answers | Technical note | 2023-01-12 |
| PSMN4R0-30YLD_RC_Thermal_Model | PSMN4R0-30YLD Thermal design model | Thermal design | 2021-01-18 |
| PSMN4R0-30YLD | PSMN4R0-30YLD Thermal model | Thermal model | 2013-09-17 |
| SOT669_115 | LFPAK56; Reel pack for SMD, 7"; Q1/T1 product orientation | Packing information | 2022-05-10 |
| REFLOW_BG-BD-1 | Reflow soldering profile | Reflow soldering | 2021-04-06 |
| WAVE_BG-BD-1 | Wave soldering profile | Wave soldering | 2021-09-08 |
Support
If you are in need of design/technical support, let us know and fill in the answer form, we'll get back to you shortly.
Models
| File name | Title | Type | Date |
|---|---|---|---|
| PSMN4R0-30YLD | PSMN4R0-30YLD Spice model | SPICE model | 2013-09-17 |
| PSMN4R0-30YLD_RC_Thermal_Model | PSMN4R0-30YLD Thermal design model | Thermal design | 2021-01-18 |
| PSMN4R0-30YLD | PSMN4R0-30YLD Thermal model | Thermal model | 2013-09-17 |
PCB Symbol, Footprint and 3D Model
| Model Name | Description |
|---|---|
Ordering, pricing & availability
| Type number | Orderable part number | Ordering code (12NC) | Packing | Packing quantity | Buy online |
|---|---|---|---|---|---|
| PSMN4R0-30YLD | PSMN4R0-30YLDX | 934067796115 | SOT669_115 | - | Order product |
Sample
As a Nexperia customer you can order samples via our sales organization or directly via our Online Sample Store: https://extranet.nexperia.com.
Sample orders normally take 2-4 days for delivery.
If you do not have a direct account with Nexperia our network of global and regional distributors is available and equipped to support you with Nexperia samples.
How does it work?
The interactive datasheets are based on the Nexperia MOSFET precision electrothermal models. With our interactive datasheets you can simply specify your own conditions interactively. Start by changing the values of the conditions. You can do this by using the sliders in the condition fields. By dragging the sliders you will see how the MOSFET will perform at the new conditions set.