Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

Body Control Module (seat / roof / door / mirror)

Body Control Modules (BCMs) interface with the Body Control Unit (BCU) to control local loads, enabling a wider range of vehicle body functions than a centralized single-BCU architecture, particularly in high-performance vehicles. They drive numerous actuators (such as brushed DC motors, on/off loads and LED lighting) while managing power delivery in the correct direction and format. As these loads are typically lower power, BCMs can use smaller control devices in DFN and CFP packages, or cost-efficient micro-leaded alternatives, due to lower thermal stress. In addition, load feedback signals are conditioned and protected to satisfy signal-processing requirements.

  • Block diagram
  • Design considerations
  • Product listing
  • Design resources
  • Support

Block diagram

Power interface Load management Signal processing Communication interface Sub - control modules Battery aaa-045208 Brushedmotors Lighting On / off loads Sensor feedback M Highlighted components are Nexperia focus products.

Control units / modules

Select a component

To view more information about the Nexperia components used in this application, please select a component above or click on a component (highlighted in blue) in the block diagram.

Design considerations

  • Rugged and robust packages (LFPAK, MLPAK and CFP packages) further support space saving, thermal efficiency and high reliability levels when driving low- to medium-power loads
  • Requires scalable and flexible product families tailored to BCU communication interfaces and output options for load management
  • ESD protection qualified and tested to the latest standards for high-speed communication networks between the BCU and other vehicle subsystem controllers
  • Small signal discrete and logic devices provide additional safety features independent of the main processor
  • DFN and CFP packages provide space saving, improved thermal performance and possibility of automatic optical inspection