Products - Motor drive
Products - Battery protection / isolation
Products - DC/DC conversion
Products - HMI / MMI
- Trend is towards more powerful PWM driven Brushless DC motor control
- Best thermal performance thanks to clip-bonding package, Rth 3x better than competition resulting in half the temperature
- Lower switch losses further improve thermal behaviour
- Reliable clip-bonding package technology for high anti stall robustness
- As a worldwide leading producer of ESD components, HMI and Displays will be secured from any ESD damage
- LFPAK and CFP (both clip-bond package) allow high-efficiency motor drive and DCDC converter solutions while reducing costs (less heating to dissipate, smaller inductance and capacitor)
- For specific applications MOSFETs may need to meet different spacing requirements like UL2595
MOSFET and GaN FET Handbook
Drawing on over 20 years’ of experience, the MOSFET and GaN FET Application Handbook: A Power Design Engineer’s Guide brings together a comprehensive set of learning and reference materials relating to the use of MOSFETs and GaN FETs in real world systems.
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