Chemical content 74AHC1G07GW

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Type numberPackagePackage descriptionTotal product weight
74AHC1G07GWSOT353-1UMT55.47482 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
93526747012518126030 s123520 s3Seremban, Malaysia; Nijmegen, Netherlands; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0072975.000000.13316
PolymerResin systemProprietary0.0024325.000000.04439
DieDoped siliconSilicon (Si)7440-21-30.06536100.000001.19377
Lead FrameCopper alloyCopper (Cu)7440-50-81.9077596.8400034.84586
Iron (Fe)7439-89-60.045512.310000.83121
Lead (Pb)7439-92-10.000200.010000.00360
Phosphorus (P)7723-14-00.001380.070000.02519
Zinc (Zn)7440-66-60.002360.120000.04318
Pure metal layerSilver (Ag)7440-22-40.012800.650000.23389
Mould CompoundFillerSilica -amorphous-7631-86-91.0906835.0700019.92170
Silica fused60676-86-01.3634243.8400024.90354
PigmentCarbon black1333-86-40.007780.250000.14201
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.3110010.000005.68055
Phenol Formaldehyde resin (generic)9003-35-40.309139.940005.64647
Polyethylene (PE) -wax-9002-88-40.027990.900000.51125
Post-PlatingImpurityAntimony (Sb)7440-36-00.000010.003000.00017
Bismuth (Bi)7440-69-90.000000.001000.00006
Copper (Cu)7440-50-80.000000.001000.00006
Lead (Pb)7439-92-10.000020.005000.00028
Tin solderTin (Sn)7440-31-50.3099799.990005.66172
WireImpurityNon hazardousProprietary0.000000.010000.00002
Pure metalCopper (Cu)7440-50-80.0097499.990000.17791
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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