Chemical content 74AHC273BQ-Q100

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Type numberPackagePackage descriptionTotal product weight
74AHC273BQ-Q100SOT764-1DHVQFN2028.37540 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
935300187115512601235Nijmegen, Netherlands; Suzhou, China; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.000851.000000.00301
FillerSilver (Ag)7440-22-40.0639675.000000.22541
PolymerAcrylic resinProprietary0.005126.000000.01803
Resin systemProprietary0.0153518.000000.05410
DieDoped siliconSilicon (Si)7440-21-30.33908100.000001.19500
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-810.4984797.4700036.99851
Iron (Fe)7439-89-60.258502.400000.91101
Phosphorus (P)7723-14-00.003230.030000.01139
Zinc (Zn)7440-66-60.010770.100000.03796
Mould CompoundAdditiveNon hazardousProprietary0.476512.910001.67931
FillerSilica -amorphous-7631-86-90.571483.490002.01401
Silica fused60676-86-013.8892184.8200048.94806
PigmentCarbon black1333-86-40.026200.160000.09233
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.176851.080000.62325
Epoxy resin systemProprietary0.260361.590000.91756
Phenolic resinProprietary0.368442.250001.29843
Tetramethylbiphenyl diglycidyl ether85954-11-60.605873.700002.13520
Pre-PlatingPure metal layerGold (Au)7440-57-50.021543.000000.07592
Nickel (Ni)7440-02-00.6628292.300002.33591
Palladium (Pd)7440-05-30.022263.100000.07845
Silver (Ag)7440-22-40.011491.600000.04049
WirePure metalCopper (Cu)7440-50-80.0840196.550000.29607
Pure metal layerGold (Au)7440-57-50.000300.350000.00107
Palladium (Pd)7440-05-30.002703.100000.00951
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.