Chemical content 74AHC3GU04DC

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Type numberPackagePackage descriptionTotal product weight
74AHC3GU04DCSOT765-1VSSOP89.98304 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
9352751241251112601235Suzhou, China; Nijmegen, Netherlands; Ayutthaya, Thailand; Bangkok, Thailand 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.000361.000000.00359
FillerSilver (Ag)7440-22-40.0268875.000000.26926
PolymerAcrylic resinProprietary0.002156.000000.02154
Resin systemProprietary0.0064518.000000.06462
DieDoped siliconSilicon (Si)7440-21-30.13222100.000001.32440
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-83.3985597.0000034.04324
Nickel (Ni)7440-02-00.105113.000001.05288
Mould CompoundFillerSilica -amorphous-7631-86-90.037090.600000.37157
Silica fused60676-86-04.8426078.3300048.50823
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-80.377126.100003.77761
PigmentCarbon black1333-86-40.012360.200000.12386
PolymerEpoxy resin systemProprietary0.547888.862005.48806
Phenolic resinProprietary0.365255.908003.65871
Pre-PlatingPure metal layerGold (Au)7440-57-50.003093.000000.03094
Nickel (Ni)7440-02-00.0950292.300000.95184
Palladium (Pd)7440-05-30.003193.100000.03197
Silver (Ag)7440-22-40.001651.600000.01650
WirePure metalCopper (Cu)7440-50-80.02607100.000000.26114
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.