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Chemical content 74LVC2G66DC-Q100

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Type numberPackagePackage descriptionTotal product weight
74LVC2G66DC-Q100SOT765-1VSSOP810.04181 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
935301411125812601235Nijmegen, Netherlands; Bangkok, Thailand; Ayutthaya, Thailand; Suzhou, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0287180.100000.28588
PolymerResin systemProprietary0.0071319.900000.07102
subTotal0.03584100.000000.35690
DieDoped siliconSilicon (Si)7440-21-30.19013100.000001.89336
subTotal0.19013100.000001.89336
Lead Frame MaterialCopper alloyCopper (Cu)7440-50-83.3985597.0000033.84400
Nickel (Ni)7440-02-00.105113.000001.04672
subTotal3.50366100.0000034.89072
Mould CompoundAdditiveNon hazardousProprietary0.290574.700002.89358
FillerSilica fused60676-86-04.8840279.0000048.63682
Flame retardantMagnesium Hydroxide (Mg(OH)2)1309-42-80.370946.000003.69394
PigmentCarbon black1333-86-40.012360.200000.12313
Polymer1,4-Bis(methoxymethyl)benzene/phenol copolymer26834-02-60.247294.000002.46262
Non hazardousProprietary0.253474.100002.52419
Tetramethylbiphenyl diglycidyl ether85954-11-60.123652.000001.23131
subTotal6.18230100.0000061.56559
Pre-PlatingPure metal layerGold (Au)7440-57-50.003093.000000.03076
Nickel (Ni)7440-02-00.0950292.300000.94627
Palladium (Pd)7440-05-30.003193.100000.03178
Silver (Ag)7440-22-40.001651.600000.01640
subTotal0.10295100.000001.02521
WirePure metalCopper (Cu)7440-50-80.02693100.000000.26819
subTotal0.02693100.000000.26819
total10.04181100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.