Chemical content BUK9M24-60E/C4

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Type numberPackagePackage descriptionTotal product weight
BUK9M24-60E/C4SOT1210mLFPAK37.45800 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
934662142115012601260Dongguan, China; Seremban, Malaysia; Sherman, United States Of America; Hsin-chu, Taiwan; Manchester, United Kingdom; Cabuyao, PhilippinesLeaded
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
DieDoped siliconSilicon (Si)7440-21-31.03800100.000002.77110
ClipCopper alloyCopper (Cu)7440-50-85.6886099.8000015.18661
Iron (Fe)7439-89-60.008550.150000.02283
Phosphorus (P)7723-14-00.002850.050000.00761
Lead FrameCopper alloyCopper (Cu)7440-50-813.8722099.8000037.03401
Iron (Fe)7439-89-60.020850.150000.05566
Phosphorus (P)7723-14-00.006950.050000.01855
Mould CompoundFillerSilica fused60676-86-05.2886062.0000014.11875
Flame retardantAluminium Hydroxide (Al(OH)3)21645-51-21.3221515.500003.52969
ImpuritySilicon Dioxide (SiO2)14808-60-70.017060.200000.04554
PigmentCarbon black1333-86-40.042650.500000.11386
PolymerEpichlorohydrin/o-Cresol/Formaldehyde polymer (generic)29690-82-20.9383011.000002.50494
Phenolic resinProprietary0.750648.800002.00395
Tetramethylbiphenyl diglycidyl ether85954-11-60.170602.000000.45544
Post-PlatingImpurityNon hazardousProprietary0.000380.010000.00103
Tin alloyTin (Sn)7440-31-53.8496299.9900010.27715
Solder PasteLead alloyLead (Pb)7439-92-14.1070092.5000010.96428
Silver (Ag)7440-22-40.111002.500000.29633
Tin (Sn)7440-31-50.222005.000000.59266
1 This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.
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