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Chemical content PMPB12R5UPE

Nexperia is committed to being a proactive and sustainable company, which is why chemical content information for our semiconductor products is publicly available from our website. This data serves our customers with the relevant information to assess compliance with national and international legal standards, including EU/CN RoHS, REACH, and California Proposition 65. With this detailed level of data directly retrieved from our product database, Nexperia is sticking to the highest standards in semiconductor industry. Further information is available under Environment.

Type numberPackagePackage descriptionTotal product weight
PMPB12R5UPESOT1220-2DFN2020M-67.07150 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
MSLPPTMPPTMSLPPTMPPT
934662976115412601235Hsin-chu, Taiwan; Manchester, United Kingdom; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveAdditiveNon hazardousProprietary0.001161.000000.01640
FillerSilver (Ag)7440-22-40.0974484.000001.37793
PolymerBismaleimidodiphenylmethane resin 0.0116010.000000.16404
Isobornyl Methacrylate7534-94-30.005805.000000.08202
subTotal0.11600100.000001.64039
DieDoped siliconSilicon (Si)7440-21-30.52400100.000007.41003
subTotal0.52400100.000007.41003
Lead FrameCopper alloyCopper (Cu)7440-50-82.6919895.6300038.06808
Magnesium (Mg)7439-95-40.004220.150000.05971
Nickel (Ni)7440-02-00.083892.980001.18627
Silicon (Si)7440-21-30.018300.650000.25875
Pure metal layerGold (Au)7440-57-50.000280.010000.00398
Nickel (Ni)7440-02-00.015480.550000.21894
Palladium (Pd)7440-05-30.000840.030000.01194
subTotal2.81500100.0000039.80767
Mould CompoundFillerSilica -amorphous-7631-86-90.8277723.0000011.70572
Silica fused60676-86-02.1594060.0000030.53666
Flame retardantMetal hydroxideProprietary0.107973.000001.52683
ImpurityBismuth (Bi)7440-69-90.018000.500000.25447
PigmentCarbon black1333-86-40.018000.500000.25447
PolymerEpoxy resin systemProprietary0.251937.000003.56261
Phenolic resinProprietary0.215946.000003.05367
subTotal3.59900100.0000050.89443
WireImpurityNon hazardousProprietary0.000000.010000.00002
Pure metalCopper (Cu)7440-50-80.0175099.990000.24745
subTotal0.01750100.000000.24747
total7.07150100.00000100.00000
Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.