Chemical content PMV48XPA2

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Type numberPackagePackage descriptionTotal product weight
PMV48XPA2SOT23TO-236AB9.00305 mg
12NCVersionPb-free solderingPb solderingNumber of processing cyclesAssembly siteRHF-indicator
934661338215412601235Kuching Sarawak, Malaysia; Dongguan, China 
SubpartMaterial groupSubstancesCAS numberMass(mg)Mass(%) of subpartMass(%) of total product
AdhesiveFillerSilver (Ag)7440-22-40.0308077.000000.34211
PolymerResin systemProprietary0.0092023.000000.10219
DieDoped siliconSilicon (Si)7440-21-30.19600100.000002.17704
Lead FrameCopper alloyCopper (Cu)7440-50-83.0968894.1300034.39809
Iron (Fe)7439-89-60.082912.520000.92089
Lead (Pb)7439-92-10.000990.030000.01096
Phosphorus (P)7723-14-00.004940.150000.05481
Zinc (Zn)7440-66-60.006250.190000.06943
Pure metal layerSilver (Ag)7440-22-40.098042.980001.08899
Mould CompoundAdditiveNon hazardousProprietary0.020790.410000.23089
FillerSilica -amorphous-7631-86-90.014700.290000.16331
Silica fused60676-86-04.3678086.1500048.51473
HardenerPhenolic resinProprietary0.217504.290002.41588
PigmentCarbon black1333-86-40.009630.190000.10700
PolymerEpoxy resin systemProprietary0.439578.670004.88245
Post-PlatingImpurityLead (Pb)7439-92-10.000020.004500.00017
Non hazardousProprietary0.000190.055500.00216
Tin solderTin (Sn)7440-31-50.3497999.940003.88524
WireImpurityNon hazardousProprietary0.000010.010000.00006
Pure metalCopper (Cu)7440-50-80.0570499.990000.63361
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.