Chemical content PUSB2X4D

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Type number	Package	Package description	Total product weight
PUSB2X4D	SOT457	SC-74	11.19800 mg

12NC	Version	Pb-free soldering			Pb soldering			Number of processing cycles	Assembly site	RHF-indicator
12NC	Version	MSL	PPT	MPPT	MSL	PPT	MPPT	Number of processing cycles	Assembly site	RHF-indicator
934068076125	13	1	260		1	235			Bangkok, Thailand; Nijmegen, Netherlands; Seremban, Malaysia

Subpart	Material group	Substances	CAS number	Mass(mg)	Mass(%) of subpart	Mass(%) of total product
Die	Doped silicon	Silicon (Si)	7440-21-3	0.08000	100.00000	0.71441
		subTotal		0.08000	100.00000	0.71441

Component	Additive	1-Methyl-1-phenylethyl-hydroperoxide	80-15-9	0.00070	1.00000	0.00625
		3,3'-Diaminodiphenyl sulfone	599-61-1	0.00350	5.00000	0.03126
		Non hazardous	Proprietary	0.00280	4.00000	0.02500
	Filler	Silica -amorphous-	7631-86-9	0.03500	50.00000	0.31256
	Polymer	Bismaleimidodiphenylmethane resin		0.00700	10.00000	0.06251
		Bisphenol-A Bisphenol-A Diglycidyl Ether copolymer	25036-25-3	0.01400	20.00000	0.12502
		Resin system	Proprietary	0.00700	10.00000	0.06251
		subTotal		0.07000	100.00000	0.62511

Lead Frame	Copper alloy	Copper (Cu)	7440-50-8	3.89251	97.07000	34.76073
		Iron (Fe)	7439-89-6	0.08622	2.15000	0.76991
		Phosphorus (P)	7723-14-0	0.00080	0.02000	0.00716
		Zinc (Zn)	7440-66-6	0.00241	0.06000	0.02149
	Pure metal layer	Silver (Ag)	7440-22-4	0.02807	0.70000	0.25067
		subTotal		4.01000	100.00000	35.80996

Mould Compound	Filler	Silica fused	60676-86-0	4.66470	71.00000	41.65655
	Pigment	Carbon black	1333-86-4	0.01971	0.30000	0.17601
	Polymer	Epichlorohydrin/o-Cresol/Formaldehyde polymer (generic)	29690-82-2	1.29429	19.70000	11.55822
		Phenolic resin	Proprietary	0.59130	9.00000	5.28041
		subTotal		6.57000	100.00000	58.67119

Post-Plating	Impurity	Antimony (Sb)	7440-36-0	0.00001	0.00300	0.00012
		Bismuth (Bi)	7440-69-9	0.00000	0.00100	0.00004
		Copper (Cu)	7440-50-8	0.00000	0.00100	0.00004
		Lead (Pb)	7439-92-1	0.00002	0.00500	0.00020
	Tin solder	Tin (Sn)	7440-31-5	0.44996	99.99000	4.01817
		subTotal		0.45000	100.00000	4.01857

Wire	Gold alloy	Gold (Au)	7440-57-5	0.01732	99.00000	0.15472
		Palladium (Pd)	7440-05-3	0.00018	1.00000	0.00156
		subTotal		0.01750	100.00000	0.15628

		total		11.19800	100.00000	100.00000

Note(s):
¹This is a generic description of the substance used as the actual composition of the substances are either considered proprietary or no official CAS number is available. If a CAS number is given, it is the closest match available.

Disclaimer
All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

Disclaimer

All information in this document is furnished for exploratory or indicative purposes only. All information in this document is believed to be accurate and reliable. However, Nexperia does not give any representations or warranties as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Nexperia may make changes to information published in this document at any time and without notice. Minor deviations may occur in the products from different manufacturing location. This document supersedes and replaces all information supplied prior to the publication hereof. Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.

Restricted substances declaration

The many processes used to manufacture semiconductors are complex and delicate, and require a variety of specialized chemicals and materials. To protect our employees and the environment, we have several programs in place that regulate our use of hazardous chemicals or "substances of concern". In fact, we follow some of the toughest practical standards in the industry.

We carefully monitor our use of substances categorized as restricted, hazardous, or relevant, and have committed, as part of our near-term Sustainability Program, to achieving a 100% reduction of all restricted and hazardous substances that aren’t critical use. We track our usage of chemicals in our company-wide Chemical Management program, which registers and classifies the chemical substances we handle. Any use or emission of restricted or hazardous substances must be covered by internal dispensation, so we are searching for alternatives as quickly as possible.

The Nexperia List of Hazardous Substances in Products and Packaging specifies substances that are not permitted in materials, parts, semi-finished goods and products at levels above our established threshold to ensure that no Nexperia products put on the market contain any substances that are restricted by law or other regulations, including the European Union’s Directive on the restriction of the use of certain hazardous substances in electrical and electronic equipment (commonly known as RoHS).

While most substances on this list are not permitted by law, a number of them are not permitted by Nexperia in view of upcoming legislation, their impact on the environment or on health & safety.

The Nexperia List of Hazardous Substances in Products and Packaging also contains a number of Restricted Substances. Use of these substances is allowed, but any use of these substances must be reported above the declaration threshold as specified in this list. Most substances are placed on this list because of health risks in their use and/or processing. Others are placed on this list because they limit recycling, because they are scarce or they have for instance a high environmental impact in mining.