Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

NGD4300

4 A peak high-performance dual MOSFET gate driver

The NGD4300 is a high-performance gate driver designed to drive both high-side and low-side N-channel MOSFETs in a synchronous buck or a half-bridge configuration. The floating high-side driver can work with rail voltages up to 120 V and uses a bootstrap supply with an integrated diode. Both low-side and high-side output drivers have an independent undervoltage lockout (UVLO) circuit which disables the output driver when the driver supply is below its threshold level. The NGD4300 accepts input control signals complying with both TTL and CMOS signaling as low as 2.5 V (±10%). The low voltage, provided by an internal voltage regulator, is used to supply circuitry in signal paths controlling the low-side and high-side power switches. This enables a low-power operation and a better controlled driver performance irrespective of the IC supply voltage.

Excellent delay matching of 1 ns typical is achieved for the low-side and high-side signal paths. The 4 A peak source and sink current capability of the driver’s output stage guarantees short rise- and fall-times even at high loads.

The NGD4300 is offered in the SO8, HWSON8 and HSO8 packages, and operates over an extended −40 °C to +125 °C temperature range.

 
 
 
 
 
 
 
 

Features and benefits

  • Input signals complying with both TTL and CMOS signaling of 2.5 V, 3.3 V, and 5 V
  • Output signals with excellent propagation delay matching of 1 ns typical
  • Fast propagation times of 13 ns typical
  • Switching frequency up to 1 MHz
  • 4 A peak source and 5 A sink current capability of the gate driver output stage
  • 4 ns rise and 3.5 ns fall times with 1000 pF loads
  • Bootstrap supply voltage up to 120 V using an integrated bootstrap diode
  • 8 V to 17 V VDD operation range
  • Undervoltage protection for both low-side and high-side supplies
  • Low-power consumption (IDDO = 0.6 mA typical)
  • 8 pin SO8, HWSON8 and HSO8 packages
  • ESD protection:
    • HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V

    • CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V

  • Specified from -40 °C to +125 °C

Applications

  • Current-fed, push-pull converters

  • Two-switch forward power converters

  • Class-D audio amplifiers

  • Solid-state motor drives

Package

Type number Orderable part number, (Ordering code (12NC)) Status Marking Package Package information Reflow-/Wave soldering Packing
NGD4300D NGD4300DJ
(935691535118)
Active NGD4300 SOT96-1
SO8
(SOT96-1)
SOT96-1 SO-SOJ-REFLOW
SO-SOJ-WAVE
WAVE_BG-BD-1
SOT96-1_118
NGD4300DD NGD4300DDJ
(935691635118)
Active NGD4300 SOT8063-1
HSO8
(SOT8063-1)
SOT8063-1 SOT8063-1_118
NGD4300DD-Q100 NGD4300DD-Q100J
(935691643118)
Active NGD4300 SOT8063-1
HSO8
(SOT8063-1)
SOT8063-1 SOT8063-1_118
NGD4300GC NGD4300GCJ
(935691536118)
Active NGD4300 SOT8047-1
HWSON8
(SOT8047-1)
SOT8047-1 SOT8047-1_118

Environmental information

Type number Orderable part number Chemical content RoHS RHF-indicator
NGD4300D NGD4300DJ NGD4300D rohs rhf rhf
NGD4300DD NGD4300DDJ NGD4300DD rohs rhf rhf
NGD4300DD-Q100 NGD4300DD-Q100J NGD4300DD-Q100 rohs rhf rhf
NGD4300GC NGD4300GCJ NGD4300GC rohs rhf rhf
Quality and reliability disclaimer

Documentation (10)

File name Title Type Date
NGD4300 4 A peak high-performance dual MOSFET gate driver Data sheet 2025-07-18
AN90063 Questions about package outline drawings Application note 2025-06-13
Nexperia_package_poster Nexperia package poster Leaflet 2020-05-15
SO8_SOT96-1_mk plastic, small outline package; 8 leads; 1.27 mm pitch; 4.9 mm x 3.9 mm x 1.75 mm body Marcom graphics 2017-01-28
SOT96-1 plastic, small outline package; 8 leads; 1.27 mm pitch; 4.9 mm x 3.9 mm x 1.75 mm body Package information 2020-04-21
SOT8063-1 plastic thermal enhanced small outline package; 8 leads; 1.27 mm pitch;4.9 mm × 3.9 mm ×1.7 mm body; exposed die pad Package information 2024-09-24
SOT8047-1 plastic thermal enhanced very very thin small outline package; no leads;8 terminals; 0.8 mm pitch; 4 x 4 x 0.75 mm body Package information 2024-08-21
SO-SOJ-REFLOW Footprint for reflow soldering Reflow soldering 2009-10-08
SO-SOJ-WAVE Footprint for wave soldering Wave soldering 2009-10-08
WAVE_BG-BD-1 Wave soldering profile Wave soldering 2021-09-08

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