Bipolar transistors

Diodes

ESD protection, TVS, filtering and signal conditioning

MOSFETs

SiC MOSFETs

GaN FETs

IGBTs

Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

OL-OP838

OL-OP838

Wire bond die; 4 bonding pads; 7.2 x 8.3 x 0.15 mm

Package information

Package information Package name Package description Reference Date
UC Wire bond die; 4 bonding pads; 7.2 x 8.3 x 0.15 mm 2019-05-27

Related documents

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