Package information
| Package information | Package name | Package description | Reference | Date |
|---|---|---|---|---|
| SOT1226 | X2SON5 | plastic, leadless thermal enhanced extremely thin small outline package; no leads; 5 terminals; 0.48 mm pitch; 0.8 mm x 0.8 mm x 0.35 mm body | 2012-04-18 |
Boards
| Part number | Description | Type | Quick links | Shop link |
|---|---|---|---|---|
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Description NEVB-LOGIC05 is a dual in-line logic footprint adapter board, designed to simplify the evaluation of Nexperia logic devices by offering several package footprints.
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Type Evaluation board
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Quick links
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Shop link
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Related documents
| File name | Title | Type | Date |
|---|---|---|---|
| AN90063 | Questions about package outline drawings | Application note | 2025-10-22 |
| Nexperia_document_guide_MiniLogic_MicroPak_201808 | MicroPak leadless logic portfolio guide | Brochure | 2018-09-03 |
| Nexperia_document_leaflet_Logic_X2SON_packages_062018 | X2SON ultra-small 4, 5, 6 & 8-pin leadless packages | Leaflet | 2018-06-05 |
| Nexperia_package_poster | Nexperia package poster | Leaflet | 2020-05-15 |
| X2SON5_SOT1226_mk | plastic, thermal enhanced extremely thin small outline package; no leads; 5 terminals; 0.48 mm pitch; 0.8 mm x 0.8 mm x 0.35 mm body | Marcom graphics | 2017-01-28 |
| REFLOW_BG-BD-1 | Reflow soldering profile | Other type | 2026-02-10 |
| SOT1226 | plastic, leadless thermal enhanced extremely thin small outline package; no leads; 5 terminals; 0.48 mm pitch; 0.8 mm x 0.8 mm x 0.35 mm body | Package information | 2022-05-30 |
| SOT1226C_147 | X2SON5; Reel pack, SMD, 7" Q2/T3 standard product orientation Orderable part number ending ,147 or Z Ordering code (12NC) ending 147 | Packing information | 2020-04-27 |
| SOT1226_125 | X2SON5; Reel pack for SMD, 7''; Q3/T4 product orientation | Packing information | 2020-04-21 |
| MAR_SOT1226 | MAR_SOT1226 Topmark | Top marking | 2013-06-03 |
Products in this package
Analog & Logic ICs
| Type number | Description | Quick access |
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