74AUP1G132

Low-power 2-input NAND Schmitt trigger

The 74AUP1G132 is a single 2-input NAND gate with Schmitt-trigger inputs. Schmitt-trigger action at all inputs makes the circuit tolerant of slower input rise and fall times. This device ensures very low static and dynamic power consumption across the entire V_CC range from 0.8 V to 3.6 V. This device is fully specified for partial power down applications using I_OFF. The I_OFF circuitry disables the output, preventing the potentially damaging backflow current through the device when it is powered down.

Features and benefits

Wide supply voltage range from 0.8 V to 3.6 V
CMOS low power dissipation
High noise immunity
Overvoltage tolerant inputs to 3.6 V
Low static power consumption; I_CC = 0.9 μA (maximum)
Latch-up performance exceeds 100 mA per JESD 78 Class II
Low noise overshoot and undershoot < 10 % of V_CC
I_OFF circuitry provides partial Power-down mode operation
Complies with JEDEC standards:
- JESD8-12 (0.8 V to 1.3 V)
- JESD8-11 (0.9 V to 1.65 V)
- JESD8-7 (1.65 V to 1.95 V)
- JESD8-5 (2.3 V to 2.7 V)
- JESD8C (2.7 V to 3.6 V )
ESD protection:
- HBM JESD22-A114F Class 3A exceeds 5000 V
- MM JESD22-A115-A exceeds 200 V
- CDM JESD22-C101E exceeds 1000 V
Multiple package options
Specified from -40 °C to +85 °C and -40 °C to +125 °C

Applications

Wave and pulse shaper
Astable multivibrator
Monostable multivibrator.

Parametrics

Type number	Product status	V_CC(A) (V)	V_CC(B) (V)	Logic switching levels	Output drive capability (mA)	t_pd (ns)	f_max (MHz)	Nr of bits	Power dissipation considerations	T_amb (°C)	R_th(j-a) (K/W)	Ψ_th(j-top) (K/W)	R_th(j-c) (K/W)	Package name
74AUP1G132GM	Production	0.8 - 3.6	n.a.	CMOS	± 1.9	10	70	1	ultra low	-40~125	311	7.7	157	XSON6
74AUP1G132GN	Production	0.8 - 3.6	n.a.	CMOS	± 1.9	10	70	1	ultra low	-40~125	334	22.6	207	XSON6
74AUP1G132GS	Production	0.8 - 3.6	n.a.	CMOS	± 1.9	10	70	1	ultra low	-40~125	321	28.7	215	XSON6
74AUP1G132GW	Production	0.8 - 3.6	n.a.	CMOS	± 1.9	10	70	1	ultra low	-40~125	309	79.2	179	TSSOP5
74AUP1G132GX	Production	0.8 - 3.6	n.a.	CMOS	± 1.9	10	70	1	ultra low	-40~125	322	90.7	191	X2SON5

Package

Type number	Package	Package information	Reflow-/Wave soldering	Packing	Status	Marking	Orderable part number, (Ordering code (12NC))
74AUP1G132GM	XSON6 (SOT886)	SOT886		Reel 7" Q1/T1, Q3/T4	Active	aE	74AUP1G132GM,132 ( 9352 790 59132 )
74AUP1G132GM	XSON6 (SOT886)	SOT886		Reel 7” Q1/T1 or Q2/T3	Active	aE	74AUP1G132GM,115 ( 9352 790 59115 )
74AUP1G132GN	XSON6 (SOT1115)	SOT1115		Reel 7" Q1/T1, Q3/T4	Active	aE	74AUP1G132GN,132 ( 9352 917 24132 )
74AUP1G132GS	XSON6 (SOT1202)	SOT1202		Reel 7" Q1/T1, Q3/T4	Active	aE	74AUP1G132GS,132 ( 9352 928 48132 )
74AUP1G132GW	TSSOP5 (SOT353-1)	SOT353-1	WAVE_BG-BD-1	Reel 7" Q3/T4, Reverse	Active	aE	74AUP1G132GW,125 ( 9352 790 58125 )
74AUP1G132GX	X2SON5 (SOT1226-3)	SOT1226-3		Reel 7" Q3/T4, Reverse	Active	aE	74AUP1G132GX,125 ( 9352 983 71125 )

Quality, reliability & chemical content

Type number	Orderable part number	Chemical content	Leadfree conversion date	MSL	MSL leadfree
74AUP1G132GM	74AUP1G132GM,132	74AUP1G132GM	Always Pb-free	1	1
74AUP1G132GM	74AUP1G132GM,115	74AUP1G132GM	Always Pb-free	1	1
74AUP1G132GN	74AUP1G132GN,132	74AUP1G132GN	Always Pb-free	1	1
74AUP1G132GS	74AUP1G132GS,132	74AUP1G132GS	Always Pb-free	1	1
74AUP1G132GW	74AUP1G132GW,125	74AUP1G132GW	Always Pb-free	1	1
74AUP1G132GX	74AUP1G132GX,125	74AUP1G132GX	Always Pb-free	1	1

Quality and reliability disclaimer

Documentation (14)

File name	Title	Type	Date
74AUP1G132	Low-power 2-input NAND Schmitt trigger	Data sheet	2022-01-14
aup1g132	aup1g132 IBIS model	IBIS model	2013-04-07
Nexperia_document_leaflet_Logic_X2SON_packages_062018	X2SON ultra-small 4, 5, 6 & 8-pin leadless packages	Leaflet	2018-06-05
Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904	Nexperia_document_leaflet_Logic_AUP_technology_portfolio_201904	Leaflet	2019-04-12
Nexperia_Selection_guide_2022	Nexperia Selection Guide 2022	Selection guide	2022-01-05
SOT1202	plastic, leadless extremely thin small outline package; 6 terminals; 0.35 mm pitch; 1 mm x 1mm x 0.35 mm body	Package information	2020-04-21
MAR_SOT1202	MAR_SOT1202 Topmark	Top marking	2013-06-03
WAVE_BG-BD-1	Wave soldering profile	Wave soldering	2021-09-08
SOT353-1	plastic thin shrink small outline package; 5 leads; body width 1.25 mm	Package information	2022-01-06
MAR_SOT1115	MAR_SOT1115 Topmark	Top marking	2013-06-03
SOT1115	plastic, leadless extremely thin small outline package; 6 terminals; 0.3 mm pitch; 0.9 mm x 1 mm x 0.35 mm body	Package information	2021-07-12
SOT886	plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm body	Package information	2020-04-21
MAR_SOT886	MAR_SOT886 Topmark	Top marking	2013-06-03
SOT1226-3	plastic thermal enhanced extremely thin small outline package; no leads;5 terminals; body 0.8 x 0.8 x 0.32 mm	Package information	2020-08-27

Support

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Models

File name	Title	Type	Date
aup1g132	aup1g132 IBIS model	IBIS model	2013-04-07

Ordering, pricing & availability

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