LSF0108-Q100

8-bit bidirectional multi-voltage level translator; open-drain; push-pull

The LSF0108-Q100 is an 8 Channel bidirectional multi-voltage level translator for open-drain and push-pull applications. It supports up to 100 MHz up translation and ≥ 100 MHz down translation at ≤ 30 pF capacitive load. There is no need for a direction pin which minimizes system effort. The LSF0108-Q100 supports 5 V tolerant I/O pins for compatibility with TTL levels in a variety of applications. The ability to set up different voltage translation levels on each channel makes the device very flexible and suitable for a lot of different applications.

This product has been qualified to the Automotive Electronics Council (AEC) standard Q100 (Grade 1) and is suitable for use in automotive applications.

Features and benefits

  • Automotive product qualification in accordance with AEC-Q100 (Grade 1)
    • Specified from -40 °C to +125 °C
  • Bidirectional voltage translation with no direction pin
  • Up translation
    • ≤ 100 MHz; CL = 30 pF
    • ≤ 40 MHz; CL = 50 pF
  • Down translation
    • ≥ 100 MHz; CL = 30 pF
    • ≤ 40 MHz; CL = 50 pF
  • Hot insertion
  • Bidirectional voltage level translation between:
    • 0.95 V and 1.8 V, 2.5 V, 3.3 V and 5.0 V
    • 1.2 V and 1.8 V, 2.5 V, 3.3 V and 5.0 V
    • 1.8 V and 2.5 V, 3.3 V and 5.0 V
    • 2.5 V and 3.3 V and 5.0 V
    • 3.3 V and 5.0 V
  • Low standby current
  • 5 V tolerant I/O pins to support TTL
  • Low RON provides less signal distortion
  • High-impedance I/O pins for EN = Low.
  • Flow-through pinout for easy PCB trace routing.
  • Latch-up performance exceeds 100 mA per JESD78 class II level A
  • ESD protection:
    • HBM ANSI/ESDA/JEDEC JS-001 exceeds 2000 V
    • CDM ANSI/ESDA/JEDEC JS-002 exceeds 1000 V
  • DHVQFN package with Side-Wettable Flanks enabling Automatic Optical Inspection (AOI) of solder joints

Applications

  • GPIO, MDIO, PMBus, SMBus, SDIO, UART, I²C, and other interfaces in Telecom infrastructure
  • Industrial
  • Personal computing
  • Automotive

Parametrics

Type numberProduct statusVCC(A) (V)VCC(B) (V)Logic switching levelsOutput drive capability (mA)tpd (ns)No of bitsPower dissipation considerationsTamb (°C)Ψth(j-top) (K/W)Package name
LSF0108BQ-Q100Production0.95 - 5.00.95 - 5.0CMOSn.a.1.48low-40~1250.0DHVQFN20
LSF0108PW-Q100Production0.95 - 5.00.95 - 5.0CMOSn.a.1.48low-40~1250.0TSSOP20

Package

Type numberPackagePackage informationReflow-/Wave solderingPackingStatusMarkingOrderable part number, (Ordering code (12NC))
LSF0108BQ-Q100
DHVQFN20
(SOT764-1)
SOT764-1Reel 7” Q1/T1 or Q2/T3ActiveStandard MarkingLSF0108BQ-Q100X
( 9356 909 19115 )
LSF0108PW-Q100
TSSOP20
(SOT360-1)
SOT360-1SSOP-TSSOP-VSO-WAVE
Reel 13" Q1/T1ActiveStandard MarkingLSF0108PW-Q100J
( 9356 909 18118 )

Quality, reliability & chemical content

Type numberOrderable part numberChemical contentRoHS / RHFLeadfree conversion dateMSLMSL leadfree
LSF0108BQ-Q100LSF0108BQ-Q100XLSF0108BQ-Q10011
LSF0108PW-Q100LSF0108PW-Q100JLSF0108PW-Q10011
Quality and reliability disclaimer

Documentation (5)

File nameTitleTypeDate
LSF0108_Q1008-bit bidirectional multi-voltage level translator; open-drain; push-pullData sheet2020-07-30
lsf0108LSF0108 IBIS modelIBIS model2020-04-14
SOT764-1plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 20 terminals; 0.5 mm pitch; 4.5 mm x 2.5 mm x 1 mm bodyPackage information2020-04-21
SSOP-TSSOP-VSO-WAVEFootprint for wave solderingWave soldering2009-10-08
SOT360-1plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.1 mm bodyPackage information2020-04-21

Support

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Models

File nameTitleTypeDate
lsf0108LSF0108 IBIS modelIBIS model2020-04-14

Ordering, pricing & availability

Sample

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Sample orders normally take 2-4 days for delivery.

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