74LVC1G17-Q100

Single Schmitt trigger buffer

The 74LVC1G17-Q100 is a single buffer Schmitt-trigger. Inputs can be driven from either 3.3 V or 5 V devices. This feature allows the use of these devices as translators in mixed 3.3 V and 5 V environments. This device is fully specified for partial power down applications using I_OFF. The I_OFF circuitry disables the output, preventing the potentially damaging backflow current through the device when it is powered down.

This product has been qualified to the Automotive Electronics Council (AEC) standard Q100 (Grade 1) and is suitable for use in automotive applications.

Features and benefits

Automotive product qualification in accordance with AEC-Q100 (Grade 1)
- Specified from -40 °C to +85 °C and from -40 °C to +125 °C
Wide supply voltage range from 1.65 V to 5.5 V
Overvoltage tolerant inputs to 5.5 V
High noise immunity
CMOS low power dissipation
I_OFF circuitry provides partial Power-down mode operation
±24 mA output drive (V_CC = 3.0 V)
Latch-up performance exceeds 250 mA
Direct interface with TTL levels
Unlimited rise and fall times
Complies with JEDEC standard:
- JESD8-7 (1.65 V to 1.95 V)
- JESD8-5 (2.3 V to 2.7 V)
- JESD8C (2.7 V to 3.6 V)
- JESD36 (4.5 V to 5.5 V)
ESD protection:
- HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V
- CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V
Multiple package options

Parametrics

Type number	Product status	V_CC (V)	Logic switching levels	Output drive capability (mA)	f_max (MHz)	Nr of bits	Power dissipation considerations	T_amb (°C)	R_th(j-a) (K/W)	Ψ_th(j-top) (K/W)	R_th(j-c) (K/W)	Package name
74LVC1G17GM-Q100	Production	1.65 - 5.5	CMOS/LVTTL	± 32	175	1	low	-40~125	320	8.2	163	XSON6
74LVC1G17GV-Q100	Production	1.65 - 5.5	CMOS/LVTTL	± 32	175	1	low	-40~125	278	68.5	175	TSOP5
74LVC1G17GW-Q100	Production	1.65 - 5.5	CMOS/LVTTL	± 32	175	1	low	-40~125	319	88.0	188	TSSOP5

Package

Type number	Package	Package information	Reflow-/Wave soldering	Packing	Status	Marking	Orderable part number, (Ordering code (12NC))
74LVC1G17GM-Q100	XSON6 (SOT886)	SOT886	REFLOW_BG-BD-1	SOT886_115	Active	VJ	74LVC1G17GM-Q100X ( 9356 907 64115 )
74LVC1G17GV-Q100	TSOP5 (SOT753)	SOT753	REFLOW_BG-BD-1 WAVE_BG-BD-1	SOT753_125	Active	V17	74LVC1G17GV-Q100,1 ( 9352 984 82125 )
74LVC1G17GW-Q100	TSSOP5 (SOT353-1)	SOT353-1	WAVE_BG-BD-1	SOT353-1_125	Active	VJ	74LVC1G17GW-Q100,1 ( 9352 984 83125 )

Environmental information

Type number	Orderable part number	Chemical content	Leadfree conversion date
74LVC1G17GM-Q100	74LVC1G17GM-Q100X	74LVC1G17GM-Q100	week 25, 2019
74LVC1G17GV-Q100	74LVC1G17GV-Q100,1	74LVC1G17GV-Q100	Always Pb-free
74LVC1G17GW-Q100	74LVC1G17GW-Q100,1	74LVC1G17GW-Q100	Always Pb-free

Quality and reliability disclaimer

Documentation (12)

File name	Title	Type	Date
74LVC1G17_Q100	Single Schmitt trigger buffer	Data sheet	2023-08-15
lvc1g17	74LVC1G17 IBIS model	IBIS model	2018-05-25
Nexperia_Selection_guide_2023	Nexperia Selection Guide 2023	Selection guide	2023-05-10
WAVE_BG-BD-1	Wave soldering profile	Wave soldering	2021-09-08
SOT353-1	plastic thin shrink small outline package; 5 leads; body width 1.25 mm	Package information	2022-11-15
MAR_SOT886	MAR_SOT886 Topmark	Top marking	2013-06-03
SOT886	plastic, leadless extremely thin small outline package; 6 terminals; 0.5 mm pitch; 1 mm x 1.45 mm x 0.5 mm body	Package information	2022-06-01
REFLOW_BG-BD-1	Reflow soldering profile	Reflow soldering	2021-04-06
MAR_SOT753	MAR_SOT753 Topmark	Top marking	2013-06-03
SOT753	plastic, surface-mounted package; 5 leads; 0.95 mm pitch; 2.9 mm x 1.5 mm x 1 mm body	Package information	2022-05-31
REFLOW_BG-BD-1	Reflow soldering profile	Reflow soldering	2021-04-06
WAVE_BG-BD-1	Wave soldering profile	Wave soldering	2021-09-08

Support

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Models

File name	Title	Type	Date
lvc1g17	74LVC1G17 IBIS model	IBIS model	2018-05-25

Ordering, pricing & availability

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