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Analog & Logic ICs

Automotive qualified products (AEC-Q100/Q101)

LSF0108-Q100

8-bit bidirectional multi-voltage level translator; open-drain; push-pull

The LSF0108-Q100 is an 8 Channel bidirectional multi-voltage level translator for open-drain and push-pull applications. It supports up to 100 MHz up translation and ≥ 100 MHz down translation at ≤ 30 pF capacitive load. There is no need for a direction pin which minimizes system effort. The LSF0108-Q100 supports 5 V tolerant I/O pins for compatibility with TTL levels in a variety of applications. The ability to set up different voltage translation levels on each channel makes the device very flexible and suitable for a lot of different applications.

This product has been qualified to the Automotive Electronics Council (AEC) standard Q100 (Grade 1) and is suitable for use in automotive applications.

Features and benefits

  • Automotive product qualification in accordance with AEC-Q100 (Grade 1)

    • Specified from -40 °C to +125 °C

  • Bidirectional voltage translation with no direction pin

  • Up translation

    • ≤ 100 MHz; CL = 30 pF

    • ≤ 50 MHz; CL = 50 pF

  • Down translation

    • ≥ 100 MHz; CL = 30 pF

    • ≥ 50 MHz; CL = 50 pF

  • Hot insertion

  • Bidirectional voltage level translation between:

    • 0.95 V and 1.8 V, 2.5 V, 3.3 V and 5.0 V

    • 1.2 V and 1.8 V, 2.5 V, 3.3 V and 5.0 V

    • 1.8 V and 2.5 V, 3.3 V and 5.0 V

    • 2.5 V and 3.3 V and 5.0 V

    • 3.3 V and 5.0 V

  • Low standby current

  • 5 V tolerant I/O pins to support TTL

  • Low RON provides less signal distortion

  • High-impedance I/O pins for EN = Low.

  • Flow-through pinout for easy PCB trace routing.

  • Latch-up performance exceeds 100 mA per JESD78 class II level A

  • ESD protection:

    • HBM: ANSI/ESDA/JEDEC JS-001 class 2 exceeds 2000 V

    • CDM: ANSI/ESDA/JEDEC JS-002 class C3 exceeds 1000 V

  • DHVQFN package with Side-Wettable Flanks enabling Automated Optical Inspection (AOI) of solder joints

Applications

  • GPIO, MDIO, PMBus, SMBus, SDIO, UART, I2C, and other interfaces in Telecom infrastructure

  • Industrial

  • Personal computing

  • Automotive

Parametrics

Type number VCC(A) (V) VCC(B) (V) Logic switching levels Output drive capability (mA) tpd (ns) Nr of bits Power dissipation considerations Tamb (°C) Package name
LSF0108BQ-Q100 0.95 - 5.0 0.95 - 5.0 CMOS + 64 1.4 8 low -40~125 DHVQFN20
LSF0108PW-Q100 0.95 - 5.0 0.95 - 5.0 CMOS + 64 1.4 8 low -40~125 TSSOP20

Package

Type number Orderable part number, (Ordering code (12NC)) Status Marking Package Package information Reflow-/Wave soldering Packing
LSF0108BQ-Q100 LSF0108BQ-Q100X
(935690919115)		 Active LSF0108 SOT764-1
DHVQFN20
(SOT764-1) 		SOT764-1 SOT764-1_115
LSF0108PW-Q100 LSF0108PW-Q100J
(935690918118)		 Active LSF0108 SOT360-1
TSSOP20
(SOT360-1) 		SOT360-1 SSOP-TSSOP-VSO-WAVE
SOT360-1_118

Environmental information

Type number Orderable part number Chemical content RoHS RHF-indicator
LSF0108BQ-Q100 LSF0108BQ-Q100X LSF0108BQ-Q100 rohs rhf rhf
LSF0108PW-Q100 LSF0108PW-Q100J LSF0108PW-Q100 rohs rhf rhf
Quality and reliability disclaimer

Documentation (12)

File name Title Type Date
LSF0108_Q100 8-bit bidirectional multi-voltage level translator; open-drain; push-pull Data sheet 2024-07-25
AN90050 Pin FMEA for LSF family Application note 2023-12-14
SOT764-1 3D model for products with SOT764-1 package Design support 2019-10-03
SOT360-1 3D model for products with SOT360-1 package Design support 2020-01-22
lsf0108 LSF0108 IBIS model IBIS model 2020-04-14
Nexperia_package_poster Nexperia package poster Leaflet 2020-05-15
DHVQFN20_SOT764-1_mk plastic, dual in-line compatible thermal enhanced very thin quad flat package; 20 terminals; 0.5 mm pitch; 2.5 mm x 4.5 mm x 0.85 mm body Marcom graphics 2017-01-28
TSSOP20_SOT360-1_mk plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.1 mm body Marcom graphics 2017-01-28
SOT764-1 plastic, leadless dual in-line compatible thermal enhanced very thin quad flat package; 20 terminals; 0.5 mm pitch; 4.5 mm x 2.5 mm x 1 mm body Package information 2022-06-21
SOT360-1 plastic, thin shrink small outline package; 20 leads; 0.65 mm pitch; 6.5 mm x 4.4 mm x 1.1 mm body Package information 2022-06-21
Nexperia_Selection_guide_2023 Nexperia Selection Guide 2023 Selection guide 2023-05-10
SSOP-TSSOP-VSO-WAVE Footprint for wave soldering Wave soldering 2009-10-08

Support

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Models

File name Title Type Date
SOT764-1 3D model for products with SOT764-1 package Design support 2019-10-03
SOT360-1 3D model for products with SOT360-1 package Design support 2020-01-22
lsf0108 LSF0108 IBIS model IBIS model 2020-04-14

Ordering, pricing & availability

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